Semiconductor high pressure annealing device

A semiconductor high pressure annealing device, comprising:

• a chamber body comprising:
• a lower opening;
• and
• an assembly groove located on an inner side surface of the chamber body, and comprising an inner top surface facing the lower opening;
• a cover configured to close the lower opening;
• an air tight ring disposed on the cover, wherein when the cover closes the lower opening, the air tight ring is located between the chamber body and the cover;
• a lifting mechanism configured to drive the cover to move axially;
• and
• a floating sealing structure disposed on the chamber body and located in the assembly groove, and configured to seal the cover and the chamber body and to enhance air tightness between the chamber body and the cover, wherein the floating sealing structure comprises:
• a body located in the assembly groove;
• a plurality of fixing members disposed in the chamber body and connected to the body, and configured to dispose the body on the chamber body in a floating manner;
• a first sealing ring located on an upper portion of the body and being not exposed on an inner side surface of the body, wherein the first sealing ring abuts against the inner top surface to enhance the air tightness between the body and the chamber body;
• a second sealing ring located on a lower portion of the body and being not exposed on the inner side surface of the body, wherein the second sealing ring abuts against the body and the cover, and is configured to increase air tightness between the body and the cover;
• and
• a preload spring assembly disposed on the upper portion of the body and abutting against the inner top surface, wherein the preload spring assembly acts in a longitudinal direction.