Heat treatment apparatus and heat treatment method
AssigneeTokyo Electron Limited
InventorsHibiki OTANI, Kazuhiko OOSHIMA, Taro YAMAMOTO
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Abstract
A heat treatment apparatus includes a processing container having a processing space formed therein, a stage on which a substrate is placed to face the processing space, a heating unit that heats the substrate placed on the stage, a discharge port that is open to the processing space and discharges a processing gas to the heated substrate, and a mixing section that forms a gas supply path connected to the discharge port and mixes gases such that two or more types of processing gases and a carrier gas for each of the processing gases are brought into a mixed state.
Claims11
A heat treatment apparatus comprising:
- a processing container having a processing space formed therein;
- a stage on which a substrate is placed to face the processing space;
- a heater configured to heat the substrate placed on the stage;
- a discharge port that is open to the processing space and configured to discharge a processing gas to the substrate heated by the heater;
- and
- a mixing section forming a gas supply path connected to the discharge port and configured to mix gases such that two or more types of processing gases and a carrier gas for each of the two or more types of processing gases are brought into a mixed state.
A heat treatment method comprising:
- transporting a substrate into a processing space formed inside a processing container;
- placing the substrate on a stage to face the processing space;
- heating the substrate placed on the stage by a heater;
- discharging a processing gas to the substrate heated by the heater from a discharge port that is open to the processing space;
- and
- mixing gases in a mixing section forming a gas supply path connected to the discharge port, such that two or more types of processing gases and a carrier gas for each of the two or more types of processing gases are brought into a mixed state.
Dependencies are inferred from the claim text.