C23C 16/52
Controlling or regulating the coating process
Official title: Controlling or regulating the coating process {(C23C16/45557, C23C16/279 take precedence)}
C23C16/52 (Controlling or regulating the coating process) appears on 3,059 US grants and 4,453 published applications in this corpus.
Search patents in C23C- Granted patents
- 3,059
- Published applications
- 4,453
- Assignees
- 875
- Inventors
- 7,439
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 0 | 0 |
| 1978 | 2 | 0 |
| 1979 | 1 | 0 |
| 1980 | 0 | 0 |
| 1981 | 2 | 0 |
| 1982 | 2 | 0 |
| 1983 | 3 | 0 |
| 1984 | 2 | 0 |
| 1985 | 4 | 0 |
| 1986 | 4 | 0 |
| 1987 | 2 | 0 |
| 1988 | 6 | 0 |
| 1989 | 9 | 0 |
| 1990 | 10 | 0 |
| 1991 | 6 | 0 |
| 1992 | 11 | 0 |
| 1993 | 13 | 0 |
| 1994 | 15 | 0 |
| 1995 | 29 | 0 |
| 1996 | 32 | 0 |
| 1997 | 26 | 0 |
| 1998 | 32 | 0 |
| 1999 | 45 | 0 |
| 2000 | 69 | 0 |
| 2001 | 56 | 21 |
| 2002 | 42 | 53 |
| 2003 | 36 | 47 |
| 2004 | 39 | 71 |
| 2005 | 44 | 57 |
| 2006 | 26 | 80 |
| 2007 | 25 | 75 |
| 2008 | 26 | 63 |
| 2009 | 28 | 65 |
| 2010 | 41 | 73 |
| 2011 | 37 | 95 |
| 2012 | 40 | 114 |
| 2013 | 54 | 121 |
| 2014 | 78 | 116 |
| 2015 | 114 | 258 |
| 2016 | 151 | 225 |
| 2017 | 157 | 221 |
| 2018 | 162 | 212 |
| 2019 | 190 | 260 |
| 2020 | 173 | 221 |
| 2021 | 142 | 266 |
| 2022 | 156 | 398 |
| 2023 | 196 | 308 |
| 2024 | 246 | 348 |
| 2025 | 281 | 400 |
| 2026 | 193 | 285 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Method for controlling canister temperature and raw material supply device6 Oct 2026US 12,753,496 B2Jusung Engineering Co., Ltd.
- Method of forming a layer by ALD6 Oct 2026US 12,753,497 B2ASM IP Holding B. V.
- Substrate processing apparatus and substrate processing method6 Oct 2026US 12,753,501 B2Tokyo Electron Limited
- Shower head, electrode unit, gas supply unit, substrate processing apparatus, and substrate processing system6 Oct 2026US 12,753,502 B2Tokyo Electron Limited
- Gas inlet element of a CVD reactor with two infeed points6 Oct 2026US 12,753,505 B2Aixtron SE
- Semiconductor process system and method of cleaning the same8 Oct 2026US 2026/0308756 A1Samsung Electronics Co., Ltd.
- Modulated reflection bottom cover plate design for cvd non-uniformity improvement8 Oct 2026US 2026/0308765 A1
- Rf impedance matching network8 Oct 2026US 2026/0311968 A1ASM America, Inc.
- Semiconductor wafer processing tool with improved leak check8 Oct 2026US 2026/0314308 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Chamber-accumulation extension via in-situ passivation1 Oct 2026US 2026/0297734 A1Lam Research Corporation
Most cited
By later US patents
- Programmable multizone gas injector for single-wafer semiconductor processing equipment740US 5,453,124 ATexas Instruments Incorporated · 1995
- Plasma monitoring and control method and system625US 5,576,629 AFourth State Technology, Inc. · 1996
- Method for improved remote microwave plasma source for use with substrate processing system621US 6,271,148 B1APPLIED Materials.Inc. · 2001
- Spatially programmable microelectronics process equipment using segmented gas injection showerhead with exhaust gas recirculation617US 6,821,910 B2University of Maryland, College Park · 2004
- Methods and apparatus for material deposition577US 5,119,760 ASymetrix Corporation · 1992