Spatially programmable microelectronics process equipment using segmented gas injection showerhead with exhaust gas recirculation

A method of processing a microelectronics substrate using a multizone gas injector distribution showerhead having a plurality of programmable segments, comprising the steps of:

• selectively positioning the showerhead in close proximity to the substrate;
• introducing a gas into each of the showerhead segments through one end of said segments,
• selecting the amount of exhaust gas desired to be removed from each of said segments;
• and
• removing exhaust gas from the same segment that said gas was introduced into in response to the selection made in said selection step.

A multizone gas injector and distribution showerhead for us in microelectronics substrate processing and equipment, comprising:

• a plurality of separately programmable segments, each of said segments having a wall with a first end located in proximity of the substrate and a second end spaced from said substrate and an internal cavity between said first and second ends within said wall;
• a gas inlet associated with each of said showerhead segments that introduces gases for processing into said cavities;
• and
• a selectively actuatable exhaust gas outlet associated with each of said showerhead segments that removes some of the exhaust gas from said cavities of said segments through a portion of said showerhead segments other than said first end.

A method of processing a microelectronics substrate using multizone gas injector distribution showerhead having a plurality of programmable segments, comprising the steps of:

• selectively positioning the showerhead in close proximity to the substrate;
• introducing gas into each of the showerhead segments through one end of said segments;
• exiting gas from said showerhead segments toward said substrate;
• and
• removing exhaust gas through at least one of said segments that said gas was introduced into.