C23C 16/45597
Reactive back side gas
Official title: {Reactive back side gas}
C23C16/45597 (Reactive back side gas) appears on 25 US grants and 44 published applications in this corpus.
Search patents in C23C- Granted patents
- 25
- Published applications
- 44
- Assignees
- 16
- Inventors
- 119
- Latest grant
- 18 Nov 2025
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2001 | 2 | 0 |
| 2002 | 1 | 0 |
| 2003 | 1 | 0 |
| 2004 | 1 | 1 |
| 2005 | 0 | 1 |
| 2006 | 0 | 0 |
| 2007 | 1 | 0 |
| 2008 | 0 | 0 |
| 2009 | 0 | 0 |
| 2010 | 0 | 0 |
| 2011 | 0 | 1 |
| 2012 | 0 | 0 |
| 2013 | 0 | 1 |
| 2014 | 0 | 0 |
| 2015 | 0 | 2 |
| 2016 | 2 | 2 |
| 2017 | 1 | 0 |
| 2018 | 2 | 1 |
| 2019 | 0 | 1 |
| 2020 | 1 | 3 |
| 2021 | 2 | 3 |
| 2022 | 2 | 9 |
| 2023 | 3 | 3 |
| 2024 | 3 | 7 |
| 2025 | 3 | 6 |
| 2026 | 0 | 3 |
By publication year. 2026 runs to 8 Oct.
Recent patents
- Backside reactive inhibition gas18 Nov 2025US 12,476,143 B2Lam Research Corporation
- Film forming method and semiconductor production apparatus15 Jul 2025US 12,359,308 B2Tokyo Electron Limited
- Spatially tunable deposition to compensate within wafer differential bow24 Jun 2025US 12,338,531 B2Lam Research Corporation
- Film production method and electrode foil production method for producing layer containing metal oxide8 Oct 2024US 12,112,896 B2Panasonic Intellectual Property Management Co., Ltd.
- Spatially tunable deposition to compensate within wafer differential bow2 Apr 2024US 11,946,142 B2Lam Research Corporation
- Substrate processing apparatus and operating method thereof2 Apr 2026US 2026/0092374 A1Samsung Electronics Co., Ltd.
- Method and tool for film deposition5 Feb 2026US 2026/0040841 A1Nanya Technology Corporation
- Electronic chips5 Feb 2026US 2026/0040993 A1STMicroelectronics International N. V.
- Backside layer for a semiconductor substrate18 Dec 2025US 2025/0385088 A1Lam Research Corporation
- Improved pedestals for substrate processing systems16 Oct 2025US 2025/0323086 A1Lam Research Corporation
Most cited
By later US patents
- Method and apparatus for supporting a semiconductor wafer during processing442US 6,183,565 B2ASM International N.V. · 2001
- Method for supporting a semiconductor wafer during processing378US 6,613,685 B1ASM International N.V. · 2003
- Back side deposition apparatus and applications378US 9,881,788 B2Lam Research Corporation · 2018
- Apparatus for supporting a semiconductor wafer during processing371US 6,461,439 B1ASM International N.V. · 2002
- Method and apparatus for supporting a semiconductor wafer during processing291US 7,312,156 B2ASM International N.V. · 2007