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US 2026/0040841 A1Published application
Method and tool for film deposition
AssigneeNanya Technology Corporation
InventorJI-FENG LIU
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Abstract
A method and a tool for film deposition are provided. The method of film deposition includes holding a semiconductor device in a chamber by a holding component, wherein the chamber is defined by a showerhead and a pedestal, providing reacting gases by the showerhead from a bottom side of the chamber, and forming a first dielectric layer on a backside surface of the semiconductor device.
Claims9
A method of film deposition, comprising:
- providing a semiconductor device including an active surface and a backside surface opposite to the active surface;
- holding the backside surface of the semiconductor device by a holding component;
- forming a dielectric layer on the backside surface of the semiconductor device;
- providing reacting gases by a showerhead;
- creating a plasma between the backside surface of the semiconductor device and the showerhead, wherein the reacting gases interact with the plasma;
- and
- depositing a dielectric material on the backside surface of the semiconductor device from the reacting gases;
- wherein the backside surface of the semiconductor device has a first portion covered by the holding component.
5 more elements
Dependencies are inferred from the claim text.