C23C 16/4411
Cooling of the reaction chamber walls
Official title: {Cooling of the reaction chamber walls (C23C16/45572 takes precedence)}
C23C16/4411 (Cooling of the reaction chamber walls) appears on 216 US grants and 313 published applications in this corpus.
Search patents in C23C- Granted patents
- 216
- Published applications
- 313
- Assignees
- 112
- Inventors
- 727
- Latest grant
- 22 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 0 | 0 |
| 1978 | 0 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 1 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 2 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 2 | 0 |
| 1990 | 0 | 0 |
| 1991 | 1 | 0 |
| 1992 | 1 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 1 | 0 |
| 1997 | 1 | 0 |
| 1998 | 1 | 0 |
| 1999 | 5 | 0 |
| 2000 | 7 | 0 |
| 2001 | 10 | 5 |
| 2002 | 12 | 28 |
| 2003 | 11 | 22 |
| 2004 | 8 | 9 |
| 2005 | 9 | 16 |
| 2006 | 2 | 3 |
| 2007 | 3 | 13 |
| 2008 | 5 | 16 |
| 2009 | 1 | 12 |
| 2010 | 12 | 9 |
| 2011 | 5 | 7 |
| 2012 | 12 | 15 |
| 2013 | 5 | 4 |
| 2014 | 7 | 6 |
| 2015 | 8 | 9 |
| 2016 | 7 | 9 |
| 2017 | 4 | 8 |
| 2018 | 4 | 14 |
| 2019 | 6 | 7 |
| 2020 | 9 | 17 |
| 2021 | 8 | 8 |
| 2022 | 8 | 15 |
| 2023 | 11 | 10 |
| 2024 | 9 | 24 |
| 2025 | 10 | 15 |
| 2026 | 7 | 12 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
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- Atomic layer deposition apparatus12 May 2026US 12,624,451 B2Hervannan Sauna Oy
- Heat management systems and methods8 Oct 2026US 2026/0308758 A1ASM IP Holding B. V.
- Single-chamber atomic layer deposition apparatus with dual-lid closure system20 Aug 2026US 2026/0242946 A1Swiss Cluster AG
- Heating chamber and reaction chamber2 Jul 2026US 2026/0185265 A1Naso Tech (Jiangsu) Co., Ltd
- Process modules configured for performing concurrent epitaxial deposition of material layers and semiconductor processing systems including such process modules28 May 2026US 2026/0146364 A1ASM IP Holding B. V.
- Cooling arrangements for processing systems, chambers, and related methods to modify substrate temperature profiles28 May 2026US 2026/0146365 A1APPLIED Materials.Inc.
Most cited
By later US patents
- Thermally floating pedestal collar in a chemical vapor deposition chamber805US 5,846,332 AAPPLIED Materials.Inc. · 1998
- Process feed management for semiconductor substrate processing741US 9,017,481 B1ASM America, Inc. · 2015
- Deposition reactor having vaporizing, mixing and cleaning capabilities631US 6,454,860 B2APPLIED Materials.Inc. · 2002
- Induction heated pancake epitaxial reactor616US 5,062,386 AEpitaxy Systems, Inc. · 1991
- Gas delivery apparatus and method for atomic layer deposition586US 6,916,398 B2APPLIED Materials.Inc. · 2005