C11D 7/3263
Amides or imides
Official title: {Amides or imides}
C11D7/3263 (Amides or imides) appears on 162 US grants and 178 published applications in this corpus.
Search patents in C11D- Granted patents
- 162
- Published applications
- 178
- Assignees
- 101
- Inventors
- 383
- Latest grant
- 16 Jun 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1980 | 1 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 1 | 0 |
| 1987 | 0 | 0 |
| 1988 | 1 | 0 |
| 1989 | 0 | 0 |
| 1990 | 1 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 2 | 0 |
| 1995 | 2 | 0 |
| 1996 | 1 | 0 |
| 1997 | 3 | 0 |
| 1998 | 1 | 0 |
| 1999 | 6 | 0 |
| 2000 | 5 | 0 |
| 2001 | 9 | 5 |
| 2002 | 8 | 12 |
| 2003 | 9 | 7 |
| 2004 | 2 | 14 |
| 2005 | 5 | 17 |
| 2006 | 8 | 5 |
| 2007 | 5 | 5 |
| 2008 | 7 | 4 |
| 2009 | 2 | 9 |
| 2010 | 6 | 7 |
| 2011 | 5 | 4 |
| 2012 | 7 | 4 |
| 2013 | 2 | 7 |
| 2014 | 6 | 5 |
| 2015 | 4 | 7 |
| 2016 | 4 | 6 |
| 2017 | 4 | 4 |
| 2018 | 5 | 5 |
| 2019 | 4 | 12 |
| 2020 | 7 | 10 |
| 2021 | 8 | 2 |
| 2022 | 7 | 8 |
| 2023 | 2 | 3 |
| 2024 | 4 | 4 |
| 2025 | 5 | 6 |
| 2026 | 3 | 6 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Metal residue removing liquid, metal residue removing method, and metal wiring manufacturing method16 Jun 2026US 12,655,370 B2Tokyo Ohka Kogyo.Co., Ltd.
- Surface treatment composition, surface treatment method, and method for producing semiconductor substrate24 Mar 2026US 12,584,083 B2Fujimi Incorporated
- Method for producing decomposing/cleaning composition10 Feb 2026US 12,545,862 B2Resonac Corporation
- Process solution composition for polymer treatment comprising a fluorine compound, a ketone solvent, and a polar aprotic solvent30 Dec 2025US 12,509,598 B2Dongwoo Fine-Chem Co., Ltd.
- Film cleaning solution and method for cleaning film2 Dec 2025US 12,485,387 B2Tokyo Ohka Kogyo.Co., Ltd.
- Cleaning composition and method of forming photoresist pattern using the same1 Oct 2026US 2026/0297468 A1Dongwoo Fine-Chem Co., Ltd.
- Cleaning composition for organic and inorganic materials, method for cleaning using the same and electronic device manufactured using the same16 Jul 2026US 2026/0201282 A1Poong Won Chemical Co., Ltd.
- Cleaning composition and method for removing polymer film using the same18 Jun 2026US 2026/0167901 A1Hongyue Advanced Technology Co., Ltd.
- Wafer cleaning device and wafer cleaning method21 May 2026US 2026/0143993 A1Samsung Electronics Co., Ltd.
- Cleaning composition2 Apr 2026US 2026/0092239 A1Dongwoo Fine-Chem Co., Ltd.
Most cited
By later US patents
- Cleaning compositions for removing etching residue and method of using150US 5,334,332 AEKC Technology, Inc. · 1994
- Post clean treatment composition comprising an organic acid and hydroxylamine137US 5,981,454 AEKC Technology, Inc. · 1999
- Stripping composition and method of using the same114US 4,617,251 AOlin Hunt Specialty Products Inc. · 1986
- Stripping compositions comprising hydroxylamine and alkanolamine89US 5,279,771 AEKC Technology, Inc. · 1994
- Post clean treatment85US 6,156,661 AEKC Technology, Inc. · 2000