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US 2026/0092239 A1Published application
Cleaning composition
AssigneeDongwoo Fine-Chem Co., Ltd.
InventorsSOON HONG PANG, TAE HEE KIM, JEONG HYUN KIM, HAN BYEOL KANG, HYUNG JIN CHO
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Abstract
A cleaning composition includes a cyclic amide-based compound represented by Chemical Formula 1, a polar aprotic solvent, and a fluorine-based compound. The cleaning composition can rapidly remove a silicon-based polymer without generating residue and etching a metal layer. The cleaning composition can be used for a cleaning process of a wafer in a fabrication of a semiconductor device.
Claims13
A cleaning composition comprising:
- a polar aprotic solvent;
- a fluorine-based compound;
- and
- a cyclic amide-based compound represented by Chemical Formula 1:
- wherein, R1 is hydrogen, a C1 to C5 alkyl group, or a C2 to C5 alkenyl group,
- one of R2 and R3 is a C1 to C15 alkylene group, a C2 to C15 alkenylene group, a C3 to C20 cycloalkylene group, a C3 to C20 cycloalkenylene group, or a C6 to C20 arylene group,
- the other of R2 and R3 is a direct bond, a C1 to C15 alkylene group, a C2 to C15 alkenylene group, a C3 to C20 cycloalkylene group, a C3 to C20 cycloalkenylene group, a C3 to C10 heteroarylene group, a C3 to C10 heterocycloalkylene group, or a C6 to C20 arylene group, and
- m is 0 or 1.
5 more elements
Dependencies are inferred from the claim text.