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US 2026/0143993 A1Published application
Wafer cleaning device and wafer cleaning method
AssigneeSamsung Electronics Co., Ltd.
InventorsYOUNCHEOL JEONG, SANGHYUN LEE, KIHYUN PARK
Life of this patent
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Abstract
A wafer cleaning device according to an embodiment includes a chamber configured to accommodate a cleaning solution including a thermo-responsive polymer, the chamber having a structure with open top, a head assembly configured to suction one surface of a wafer and move the wafer so that the other surface of the wafer comes into contact with the cleaning solution, and a temperature adjustment unit arranged in the chamber and configured to adjust a temperature of the cleaning solution.
Claims20
A wafer cleaning device comprising:
- a chamber configured to accommodate a cleaning solution including a thermo-responsive polymer, the chamber having a structure with open top;
- a head assembly configured to suction one surface of a wafer and move the wafer so that the other surface of the wafer comes into contact with the cleaning solution;
- and
- a temperature adjustment unit arranged in the chamber and configured to adjust a temperature of the cleaning solution.
1 more element
A wafer cleaning device comprising:
- a chamber configured to accommodate a cleaning solution including a thermo-responsive polymer, the chamber having a cylindrical structure with open top;
- a loading unit configured such that a wafer is seated on the loading unit;
- a suction head configured to suction one surface of the wafer;
- a connection portion connected to the suction head on one side of the connection portion to support the suction head;
- a support portion connected to the other side of the connection portion to support the connection portion, the support portion rotatable about a vertical axis along with the suction head and movable along the vertical axis;
- and
- a temperature adjustment unit configured to adjust a temperature of the cleaning solution.
4 more elements
A wafer cleaning method comprising:
- adjusting a temperature of a cleaning solution accommodated in a chamber to a first temperature;
- suctioning one surface of a wafer seated on a loading unit and moving the wafer above the chamber;
- moving the wafer downward so that the other surface of the wafer comes into contact with the cleaning solution;
- and
- separating the other surface of the wafer from the cleaning solution,
- wherein the first temperature is a phase change temperature of the cleaning solution, and the cleaning solution is present in a rubbery state at the first temperature.
3 more elements
Dependencies are inferred from the claim text.