Surface treatment composition, surface treatment method, and method for producing semiconductor substrate
AssigneeFujimi Incorporated
InventorsHideyuki Tokushima, Tsutomu Yoshino
Life of this patent
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Abstract
Provided is a means for sufficiently removing residues remaining on the surface of a polished object and reducing the surface roughness of the polished object. The present invention relates to a surface treatment composition containing components (A) to (C), and having pH of more than 7.0: the component (A): a cyclic amine compound having a nitrogen-containing non-aromatic heterocyclic ring, the component (B): a nonionic polymer, the component (C): a buffer represented by a formula: A-COO−NH4+ wherein A is an alkyl group having from 1 to 10 carbon atoms, or a phenyl group.
Claims16
A surface treatment composition, comprising components (A) to (C), wherein pH of the composition is more than 7.0:
- the component (A):
- a cyclic amine compound having a nitrogen-containing non-aromatic heterocyclic ring,
- the component (B):
- a nonionic polymer,
- the component (C):
- a buffer represented by a formula:
- A-COO−NH4+ wherein A is an alkyl group having from 1 to 10 carbon atoms.
Dependencies are inferred from the claim text.