C09K 13/06
With organic material
Official title: with organic material
C09K13/06 (With organic material) appears on 389 US grants and 552 published applications in this corpus.
Search patents in C09K- Granted patents
- 389
- Published applications
- 552
- Assignees
- 161
- Inventors
- 1,044
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1983 | 1 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 1 | 0 |
| 1987 | 0 | 0 |
| 1988 | 1 | 0 |
| 1989 | 2 | 0 |
| 1990 | 2 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 1 | 0 |
| 1997 | 0 | 0 |
| 1998 | 2 | 0 |
| 1999 | 3 | 0 |
| 2000 | 2 | 0 |
| 2001 | 6 | 2 |
| 2002 | 4 | 8 |
| 2003 | 2 | 3 |
| 2004 | 2 | 7 |
| 2005 | 1 | 5 |
| 2006 | 5 | 6 |
| 2007 | 2 | 3 |
| 2008 | 6 | 10 |
| 2009 | 3 | 9 |
| 2010 | 3 | 7 |
| 2011 | 5 | 5 |
| 2012 | 9 | 8 |
| 2013 | 7 | 17 |
| 2014 | 10 | 27 |
| 2015 | 22 | 29 |
| 2016 | 21 | 14 |
| 2017 | 14 | 18 |
| 2018 | 10 | 24 |
| 2019 | 21 | 45 |
| 2020 | 25 | 49 |
| 2021 | 46 | 60 |
| 2022 | 42 | 55 |
| 2023 | 30 | 44 |
| 2024 | 34 | 39 |
| 2025 | 23 | 39 |
| 2026 | 21 | 19 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Composition and method for treating substrate6 Oct 2026US 12,753,342 B2FUJIFILM Corporation
- Methods of forming an abrasive slurry and methods for chemical-mechanical polishing29 Sep 2026US 12,746,637 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Selective etching solution for 3D NAND structure sheet29 Sep 2026US 12,747,389 B2Hubei Sinophorus Electronic Materials Co., Ltd.
- Compositions for polishing hardmasks and related systems and methods22 Sep 2026US 12,742,097 B2Entegris, Inc.
- Chemical mechanical polishing composition and polishing method22 Sep 2026US 12,742,098 B2Jsr Corporation
- Composition For TiN Hard Mask Removal While Compatible With Tungsten8 Oct 2026US 2026/0308449 A1Versum Materials US, LLC
- Composition for etching and method for manufacturing semiconductor device using same8 Oct 2026US 2026/0308450 A1Soulbrain Co., Ltd.
- Method for etching polysilicon1 Oct 2026US 2026/0297425 A1Entegris, Inc.
- Polishing compositions and methods of use thereof24 Sep 2026US 2026/0286184 A1Fujifilm Electronic Materials U.S.A., Inc.
- Composition, method of treating metal-containing film and method of manufacturing electronic device24 Sep 2026US 2026/0293557 A1Samsung Electronics Co., Ltd.
Most cited
By later US patents
- Chemical mechanical polishing composition and process142US 6,117,783 AEKC Technology, Inc. · 2000
- Oxide etching method122US 8,168,544 B2Canon Kabushiki Kaisha · 2012
- Method of wafer cleaning, and system and cleaning solution regarding same112US 5,783,495 AMicron Technology, Inc. · 1998
- System for wafer cleaning59US 6,235,145 B1Micron Technology, Inc. · 2001
- Chemical mechanical polishing composition and process55US 6,313,039 B1EKC Technology, Inc. · 2001