B81C 99/0005
Apparatus specially adapted for the manufacture or treatment of microstructural devices or
Official title: {Apparatus specially adapted for the manufacture or treatment of microstructural devices or systems, or methods for manufacturing the same}
B81C99/0005 (Apparatus specially adapted for the manufacture or treatment of microstructural devices or) appears on 221 US grants and 268 published applications in this corpus.
Search patents in B81C- Granted patents
- 221
- Published applications
- 268
- Assignees
- 158
- Inventors
- 456
- Latest grant
- 25 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1997 | 1 | 0 |
| 1998 | 0 | 0 |
| 1999 | 1 | 0 |
| 2000 | 1 | 0 |
| 2001 | 1 | 1 |
| 2002 | 1 | 5 |
| 2003 | 4 | 12 |
| 2004 | 8 | 6 |
| 2005 | 6 | 6 |
| 2006 | 4 | 8 |
| 2007 | 3 | 7 |
| 2008 | 7 | 7 |
| 2009 | 3 | 5 |
| 2010 | 7 | 14 |
| 2011 | 8 | 8 |
| 2012 | 7 | 10 |
| 2013 | 11 | 9 |
| 2014 | 11 | 23 |
| 2015 | 21 | 27 |
| 2016 | 21 | 19 |
| 2017 | 10 | 9 |
| 2018 | 13 | 14 |
| 2019 | 12 | 16 |
| 2020 | 12 | 12 |
| 2021 | 12 | 7 |
| 2022 | 9 | 16 |
| 2023 | 9 | 4 |
| 2024 | 8 | 10 |
| 2025 | 7 | 10 |
| 2026 | 3 | 3 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Integrated dicing die bonding sheet and method for producing semiconductor device25 Aug 2026US 12,721,105 B2Dow Toray Co., Ltd.
- Electronic device, electronic device manufacturing apparatus, and method for manufacturing electronic device11 Aug 2026US 12,703,622 B2Kabushiki Kaisha Toshiba
- Method and arrangement for assembly of microchips into a separate substrate6 Jan 2026US 12,515,947 B2Sensible Holding B.V.
- Mirror device manufacturing method and mirror unit manufacturing method30 Dec 2025US 12,509,347 B2Hamamatsu Photonics K.K.
- Deposition apparatus2 Dec 2025US 12,488,969 B2SPTS Technologies Limited
- Lensless near-contact imaging system for micro assembly12 Mar 2026US 2026/0075327 A1Genesee Valley Innovations, LLC
- High speed manufacture of micro-electrical mechanical systems arrays29 Jan 2026US 2026/0028223 A1The University of British Columbia
- Heterogeneous integration of components onto compact devices using moiré based metrology and vacuum based pick-and-place1 Jan 2026US 2026/0005060 A1Board of Regents, The University of Texas System
- Heterogeneous integration of components onto compact devices using moiré based metrology and vacuum based pick-and-place18 Dec 2025US 2025/0385120 A1Board of Regents, The University of Texas System
- Heterogeneous integration of components onto compact devices using moiré based metrology and vacuum based pick-and-place18 Dec 2025US 2025/0385121 A1Board of Regents, The University of Texas System
Most cited
By later US patents
- Stabilization structure including shear release posts171US 9,217,541 B2LuxVue Technology Corporation · 2015
- Method and tool for handling micro-mechanical structures146US 6,255,721 B1Read-Rite Corporation · 2001
- Stabilization structure including sacrificial release layer and staging cavity144US 9,166,114 B2LuxVue Technology Corporation · 2015
- Microfabricated therapeutic actuator mechanisms112US 5,645,564 AThe Regents of the University of California · 1997
- Micro device transfer head with silicon electrode101US 8,415,771 B1LuxVue Technology Corporation · 2013