B81C 99/0025
Apparatus specially adapted for the manufacture or treatment of microstructural devices or
Official title: {Apparatus specially adapted for the manufacture or treatment of microstructural devices or systems not provided for in B81C99/001 - B81C99/002}
B81C99/0025 (Apparatus specially adapted for the manufacture or treatment of microstructural devices or) appears on 56 US grants and 68 published applications in this corpus.
Search patents in B81C- Granted patents
- 56
- Published applications
- 68
- Assignees
- 58
- Inventors
- 151
- Latest grant
- 25 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2000 | 1 | 0 |
| 2001 | 0 | 1 |
| 2002 | 1 | 2 |
| 2003 | 1 | 2 |
| 2004 | 0 | 1 |
| 2005 | 2 | 1 |
| 2006 | 1 | 1 |
| 2007 | 0 | 1 |
| 2008 | 1 | 0 |
| 2009 | 0 | 0 |
| 2010 | 0 | 0 |
| 2011 | 1 | 3 |
| 2012 | 0 | 4 |
| 2013 | 3 | 3 |
| 2014 | 2 | 7 |
| 2015 | 4 | 5 |
| 2016 | 6 | 7 |
| 2017 | 2 | 1 |
| 2018 | 6 | 7 |
| 2019 | 4 | 7 |
| 2020 | 7 | 1 |
| 2021 | 4 | 4 |
| 2022 | 2 | 3 |
| 2023 | 0 | 1 |
| 2024 | 2 | 5 |
| 2025 | 4 | 1 |
| 2026 | 2 | 0 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Integrated dicing die bonding sheet and method for producing semiconductor device25 Aug 2026US 12,721,105 B2Dow Toray Co., Ltd.
- Electronic device, electronic device manufacturing apparatus, and method for manufacturing electronic device11 Aug 2026US 12,703,622 B2Kabushiki Kaisha Toshiba
- Mirror device manufacturing method and mirror unit manufacturing method30 Dec 2025US 12,509,347 B2Hamamatsu Photonics K.K.
- Deposition apparatus2 Dec 2025US 12,488,969 B2SPTS Technologies Limited
- Process and apparatus for the preparation of a bonded substrate14 Oct 2025US 12,441,608 B2Sherkin Technologies Limited
- Apparatus for adjusting spacing between moire superlattices of two-dimensional materials27 Feb 2025US 2025/0072073 A1University-Industry Cooperation Group of Kyung Hee University
- Quartz crystal microbalance (qcm) sensor having rapid registration response3 Oct 2024US 2024/0329001 A1Inficon GmbH
- Electronic device, electronic device manufacturing apparatus, and method for manufacturing electronic device6 Jun 2024US 2024/0182294 A1Kabushiki Kaisha Toshiba
- Integrated dicing die bonding sheet and method for producing semiconductor device14 Mar 2024US 2024/0087941 A1Dow Toray Co., Ltd.
- Method and apparatus for the optical contact bonding of components1 Feb 2024US 2024/0036345 A1Carl Zeiss SMT GmbH
Most cited
By later US patents
- Micro device transfer head with silicon electrode101US 8,415,771 B1LuxVue Technology Corporation · 2013
- Method for vapor phase etching of silicon50US 7,041,224 B2Reflectivity, INC · 2006
- Methods of fabricating housing structures and micromachines incorporating such structures46US 6,562,278 B1Micron Technology, Inc. · 2003
- Gas-phase silicon etching with bromine trifluoride30US 6,162,367 ACalifornia Institute of Technology · 2000
- Gas phase silicon etching with bromine trifluoride27US 6,436,229 B2California Institute of Technology · 2002