Electronic device, electronic device manufacturing apparatus, and method for manufacturing electronic device
AssigneeKabushiki Kaisha Toshiba
InventorHiroki HIRAGA
Life of this patent
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Abstract
According to one embodiment, an electronic device includes a housing, a first member, an electronic element, a getter member, and a second member. The housing includes a first portion. A first gap is provided between the first portion and the first member. A space surrounded by the housing and the first member is sealed at 1 atmospheric pressure or less. The electronic element is provided in the space. The getter member is provided in the space and fixed to the first member. The second member is fixed to the first member. At least a part of the first member is provided between the getter member and the second member. A melting point of the second member is lower than a melting point of the first member.
Claims20
An electronic device, comprising:
- a housing including a first portion;
- a first member, a first gap being provided between the first portion and the first member, a space surrounded by the housing and the first member being sealed at 1 atmospheric pressure or less;
- an electronic element provided in the space;
- a getter member provided in the space and fixed to the first member;
- and
- a second member fixed to the first member, at least a part of the first member being provided between the getter member and the second member, a melting point of the second member being lower than a melting point of the first member.
An electronic device manufacturing apparatus, comprising:
- a cooling portion;
- and
- a heating portion,
- an electronic device including:
- a housing including a first portion,
- a first member, a first gap being provided between the first portion and the first member, a space surrounded by the housing and the first member being sealed at 1 atmospheric pressure or less,
- an electronic element provided in the space,
- a getter member provided in the space and fixed to the first member, and
- a second member fixed to the first member, at least a part of the first member being provided between the getter member and the second member, a melting point of the second member being lower than a melting point of the first member,
- the cooling portion being configured to cool at least a part of the housing, and
- the heating portion being configured to heat the second member to a temperature equal to or higher than the melting point of the second member.
A method for manufacturing an electronic device, the method comprising:
- preparing an electronic device component, the electronic device component including:
- a housing including a first portion,
- a first member, a first gap being provided between the first portion and the first member, a space surrounded by the housing and the first member being sealed at 1 atmospheric pressure or less,
- an electronic element provided in the space,
- a getter member provided in the space and fixed to the first member, and
- a second member fixed to the first member, at least a part of the first member being provided between the getter member and the second member, a melting point of the second member being lower than a melting point of the first member;
- and
- heating the second member to the melting point of the second member, or more.
Dependencies are inferred from the claim text.