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US 2025/0385121 A1Published application
Heterogeneous integration of components onto compact devices using moiré based metrology and vacuum based pick-and-place
AssigneeBoard of Regents, The University of Texas System
InventorsSidlgata V. Sreenivasan, Paras Ajay, Aseem Sayal, Mark McDermott, Shrawan Singhal, Ovadia Abed, Lawrence Dunn, Vipul Goyal, Michael Cullinan
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Abstract
A method for assembling heterogeneous components. The assembly process includes using a vacuum based pickup mechanism in conjunction with sub-nm precise moiré alignment techniques resulting in highly accurate, parallel assembly of feedstocks.
Claims12
A method for bonding an element onto a product substrate, wherein said element comprises layers of transistors, interconnects, and dielectrics, the method comprising:
- picking said element by a vacuum superstrate attached to said element;
- placing said element onto a liquid on said product substrate;
- and
- securely attaching said element onto said product substrate by holding onto said element using said vacuum superstrate until bonding occurs.
1 more element
Dependencies are inferred from the claim text.