B81C 99/001
For cutting, cleaving or grinding
Official title: {for cutting, cleaving or grinding}
B81C99/001 (For cutting, cleaving or grinding) appears on 10 US grants and 14 published applications in this corpus.
Search patents in B81C- Granted patents
- 10
- Published applications
- 14
- Assignees
- 10
- Inventors
- 33
- Latest grant
- 28 Nov 2023
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2008 | 0 | 1 |
| 2009 | 1 | 0 |
| 2010 | 0 | 1 |
| 2011 | 1 | 0 |
| 2012 | 0 | 0 |
| 2013 | 0 | 1 |
| 2014 | 0 | 0 |
| 2015 | 0 | 2 |
| 2016 | 2 | 2 |
| 2017 | 1 | 0 |
| 2018 | 0 | 2 |
| 2019 | 2 | 2 |
| 2020 | 1 | 0 |
| 2021 | 0 | 0 |
| 2022 | 1 | 1 |
| 2023 | 1 | 0 |
| 2024 | 0 | 1 |
| 2025 | 0 | 0 |
| 2026 | 0 | 1 |
By publication year. 2026 runs to 8 Oct.
Recent patents
- Shaping nanomaterials by short electrical pulses28 Nov 2023US 11,830,743 B2Board of Regents, The University of Texas System
- Wafer processing method23 Aug 2022US 11,420,294 B2Disco Corporation
- MEMS manufacturing method and MEMS manufacturing apparatus31 Mar 2020US 10,605,824 B2Hitachi, Ltd.
- Electrostatic chuck table using method10 Sep 2019US 10,410,901 B2Disco Corporation
- Lathe head for nano/micro machining of materials19 Feb 2019US 10,211,028 B2Norsam Technologies, Inc.
- High speed manufacture of micro-electrical mechanical systems arrays29 Jan 2026US 2026/0028223 A1The University of British Columbia
- Method for manufacturing a micromechanical fastening element, shaping tool for producing an impression of the micromechanical fastening element, and micromechanical fastening element15 Aug 2024US 2024/0269795 A1Nivarox-FAR S. A.
- Shaping Nanomaterials by Short Electrical Pulses6 Jan 2022US 2022/0005707 A1Board of Regents, The University of Texas System
- Lathe Head for Nano/Micro Machining of Materials13 Jun 2019US 2019/0180980 A1Norsam Technologies, Inc.
- Wafer processing method30 May 2019US 2019/0160597 A1Disco Corporation
Most cited
By later US patents