Bonded wafer assembly system and method
AssigneeTexas Instruments Incorporated
InventorsDaryl Ross Koehl, Braden Peter D'Andrea
Life of this patent
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Abstract
A system and method for the removal of superfluous material in a bonded wafer assembly. The method includes cutting a plurality of parallel cuts in a top wafer, the plurality of cuts defining a segment of the top wafer attached to another portion of the top wafer via a tab, inserting a wedge-shaped breaker bar into at least one cut of the plurality of cuts, applying force to the breaker bar to fracture the tab, and removing the segment of the top wafer from the bonded wafer assembly, wherein a bottom wafer remains unsingulated after the removing.
Claims20
A method for removing material from a bonded wafer assembly comprising a top wafer bonded to a bottom wafer, the method comprising:
- cutting a plurality of parallel cuts in the top wafer, the plurality of cuts defining a segment of the top wafer attached to another portion of the top wafer via a tab;
- inserting a wedge-shaped breaker bar into at least one cut of the plurality of cuts;
- applying force to the breaker bar to fracture the tab;
- and
- removing the segment of the top wafer from the bonded wafer assembly, wherein the bottom wafer remains unsingulated after the removing.
A system for removing superfluous material from a bonded wafer assembly, the system comprising:
- a saw ring for holding a bonded wafer assembly comprising a top wafer and a bottom wafer, wherein the top wafer has a plurality of parallel cuts formed therein, and wherein the bottom wafer is unsingulated;
- and
- a breaker bar having a wedge profile shaped to be inserted into at least one cut of the plurality of cuts.
A method for removing material from a bonded wafer assembly comprising a top wafer bonded to a bottom wafer, the method comprising:
- mounting the bonded wafer assembly in a saw ring, wherein the saw ring has a height higher than the lower wafer and lower than a top surface of the top wafer;
- cutting a plurality of parallel cuts in the top wafer, the plurality of cuts defining a segment of the top wafer attached to another portion of the top wafer via a tab;
- mounting the saw ring and the bonded wafer assembly in a vacuum chuck;
- applying a vacuum to secure the bonded wafer assembly;
- inserting a wedge-shaped breaker bar into at least one cut of the plurality of cuts;
- applying force to the breaker bar to break the tab;
- and
- removing the segment of the top wafer from the bonded wafer assembly, wherein the bottom wafer remains unsingulated after the removing.
Dependencies are inferred from the claim text.