Method and arrangement for assembly of microchips into a separate substrate
AssigneeSensible Holding B.V.
InventorsFederico Ribet, Miku Brodin-Laakso, Simone Pagliano, Frank Niklaus, Niclas Roxhed, Göran Stemme
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Abstract
A method for assembling one or more microchips into respective holes in a substrate surface of a separate receiving substrate for microchip insertion that is out-of-plane in relation to the substrate surface. The microchips are placed on the substrate surface and moved by one or more magnetic fields affecting a ferromagnetic layer of each microchip so that the microchips become out-of-plane oriented in relation to the substrate surface and are assembled into the holes.
Claims24
A method for assembling one or more microchips into one or more holes, respectively, in a substrate surface of a separate receiving substrate, wherein said method comprises:
- obtaining the substrate, the holes thereof for microchip insertion out-of-plane in relation to said substrate surface;
- obtaining said microchips, each provided with a ferromagnetic layer of ferromagnetic material;
- placing the microchips on said substrate surface;
- and
- applying and moving one or more magnetic fields affecting said ferromagnetic layer of each microchip such that the microchips become out-of-plane oriented in relation to said substrate surface and move over the substrate surface until assembled into said holes, and
- wherein in said ferromagnetic layer is patterned in one or more straight stripes with an orientation to result in directional lifting along said one or more stripes during said application of the magnetic field and cause said out-of-plane orientation.
A microchip assembly arrangement for assembling one or more microchips into one or more holes, respectively, in a substrate surface of a separate receiving substrate, wherein said microchip assembly arrangement is configured to:
- obtain the substrate, the holes thereof for microchip insertion out-of-plane in relation to said substrate surface;
- obtain said microchips, each provided with a ferromagnetic layer of ferromagnetic material;
- place the microchips on said substrate surface;
- and
- apply and move one or more magnetic fields affecting said ferromagnetic layer of each microchip such that the microchips become out-of-plane oriented in relation to said substrate surface and move over the substrate surface until assembled into said holes, and
- wherein in said ferromagnetic layer is patterned in one or more straight stripes with an orientation to result in directional lifting along said one or more stripes during said application of the magnetic field and cause said out-of-plane orientation.
A microchip assembly arrangement for assembling one or more microchips into one or more holes, respectively, in a substrate surface of a separate receiving substrate, wherein said microchip assembly arrangement is configured to:
- obtain the substrate, the holes thereof for microchip insertion out-of-plane in relation to said substrate surface;
- obtain said microchips, each provided with a ferromagnetic layer of ferromagnetic material;
- place the microchips on said substrate surface;
- and
- apply and move one or more magnetic fields affecting said ferromagnetic layer of each microchip such that the microchips thereby become out-of-plane oriented in relation to said substrate surface and move over the substrate surface until assembled into said holes, and
- wherein said holes are shaped such that each allow only specific microchip orientation or orientations for insertion into the hole, and
- wherein said microchips have a wide end that is wider than an opposite, thus narrow, end, and wherein the holes are shaped such that each allow only the narrow end of the microchip to enter the hole.
Dependencies are inferred from the claim text.