Stabilization structure including sacrificial release layer and staging cavity

A stabilization structure comprising:

• a carrier substrate;
• an array of micro devices on the carrier substrate, wherein each micro device includes a device layer with a bottom surface;
• a stabilization layer including an array of staging cavities corresponding to the array of micro devices, wherein each staging cavity includes sidewalls of the stabilization layer that completely laterally surround at least a portion of a thickness of the device layer of a corresponding micro device;
• and
• a sacrificial release layer that completely covers a bottom surface forming a lower main surface of each staging cavity, spans along the sidewalls of each cavity, and spans underneath an entirety of the bottom surface of the device layer of the corresponding micro device;
• wherein the array of micro devices is embedded in the sacrificial release layer within the array of staging cavities, wherein the stabilization layer spans directly underneath each micro device.