B81C 2203/0742
Interleave, i.e. simultaneously forming the micromechanical structure and the cmos circuit
Official title: Interleave, i.e. simultaneously forming the micromechanical structure and the CMOS circuit
B81C2203/0742 (Interleave, i.e. simultaneously forming the micromechanical structure and the cmos circuit) appears on 96 US grants and 89 published applications in this corpus.
Search patents in B81C- Granted patents
- 96
- Published applications
- 89
- Assignees
- 57
- Inventors
- 190
- Latest grant
- 17 Dec 2024
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1986 | 1 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 1 | 0 |
| 1993 | 0 | 0 |
| 1994 | 1 | 0 |
| 1995 | 1 | 0 |
| 1996 | 0 | 0 |
| 1997 | 1 | 0 |
| 1998 | 6 | 0 |
| 1999 | 0 | 0 |
| 2000 | 2 | 0 |
| 2001 | 1 | 0 |
| 2002 | 3 | 0 |
| 2003 | 1 | 0 |
| 2004 | 1 | 2 |
| 2005 | 0 | 0 |
| 2006 | 1 | 1 |
| 2007 | 0 | 2 |
| 2008 | 1 | 3 |
| 2009 | 0 | 9 |
| 2010 | 6 | 8 |
| 2011 | 7 | 10 |
| 2012 | 9 | 6 |
| 2013 | 9 | 5 |
| 2014 | 5 | 10 |
| 2015 | 12 | 10 |
| 2016 | 8 | 5 |
| 2017 | 4 | 4 |
| 2018 | 3 | 5 |
| 2019 | 3 | 2 |
| 2020 | 2 | 3 |
| 2021 | 3 | 1 |
| 2022 | 1 | 2 |
| 2023 | 1 | 0 |
| 2024 | 2 | 0 |
| 2025 | 0 | 1 |
By publication year. Applications have been published since 2001.
Recent patents
- Monolithic post complementary metal-oxide-semiconductor integration of thermoelectric-based infrared detector17 Dec 2024US 12,168,603 B2Meridian Innovation Pte Ltd
- CMOS cap for MEMS devices21 May 2024US 11,990,498 B2Meridian Innovation Pte Ltd
- Nanosheet MEMs sensor device and method of manufacture27 Jun 2023US 11,685,647 B2NXP B. V.
- CMOS-MEMS integration with through-chip via process1 Feb 2022US 11,235,969 B2Taiwan Semiconductor Manufacturing Company.Ltd
- CMOS thermal fluid flow sensing device employing a flow sensor and a pressure sensor on a single membrane15 Jun 2021US 11,035,709 B2Cambridge Enterprise Limited
- Ultrasonic sensor and manufacturing method thereof24 Apr 2025US 2025/0128288 A1Qisda Corporation
- Nanosheet MEMS Sensor Device and Method of Manufacture1 Sep 2022US 2022/0274828 A1NXP B. V.
- Monolithic post complementary metal-oxide-semiconductor integration of thermoelectric-based infrared detector16 Jun 2022US 2022/0185660 A1Meridian Innovation Pte Ltd
- Cmos cap for mems devices27 May 2021US 2021/0159263 A1Meridian Innovation Pte Ltd
- Cmos cap for mems devices25 Jun 2020US 2020/0203417 A1Meridian Innovation Pte Ltd
Most cited
By later US patents
- Microfabricated structures with trench-isolation using bonded-substrates and cavities150US 6,433,401 B1Analog Devices IMI, Inc. · 2002
- Method of manufacturing semiconductor device having a pressure sensor111US 4,618,397 AHitachi, Ltd. · 1986
- Method for fabricating monolithic chip containing integrated circuitry and suspended microstructure107US 5,326,726 AAnalog Devices, Inc. · 1994
- Integrated micro electro-mechanical system and manufacturing method thereof101US 7,402,449 B2Hitachi, Ltd. · 2008
- One-chip integrated sensor process89US 5,719,069 ADelco Electronics Corporation · 1998