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US 2021/0159263 A1Published application
Cmos cap for mems devices
AssigneeMeridian Innovation Pte Ltd
InventorsWan Chia ANG, Piotr KROPELNICKI, Ilker Ender OCAK, Paul Simon PONTIN
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Abstract
A complementary metal oxide semiconductor (CMOS) device embedded with micro-electro-mechanical system (MEMS) components in a MEMS region. The MEMS components, for example, are infrared (IR) thermoconforms. The device is encapsulated with a CMOS compatible IR transparent cap to hermetically seal the MEMS sensors in the MEMS region. The CMOS cap includes a base cap with release openings and a seal cap which seals the release openings.
Claims20
A device comprising:
- a substrate prepared with a complementary metal oxide semiconductor (CMOS) region with CMOS devices and a sensor region with micro-electro-mechanical system (MEMS) region with a MEMS component;
- and
- a CMOS compatible cap disposed on the substrate over the CMOS region and MEMS region, wherein the CMOS compatible cap includes CMOS layers, the CMOS compatible cap is elevated over the MEMS region to provide a cap cavity between the CMOS compatible cap and the MEMS region.
A method for forming a device comprising:
- providing a substrate prepared with a complementary metal oxide semiconductor (CMOS) region with CMOS devices and a sensor region with micro-electro-mechanical system (MEMS) region with a MEMS component;
- and
- forming a CMOS compatible cap on the substrate over the CMOS region and MEMS region, wherein the CMOS compatible cap includes CMOS layers, the CMOS compatible cap is elevated over the MEMS region to provide a vacuum cap cavity between the CMOS compatible cap and the MEMS region.
Dependencies are inferred from the claim text.