B81C 2203/0735
Post-cmos, i.e. forming the micromechanical structure after the cmos circuit
Official title: Post-CMOS, i.e. forming the micromechanical structure after the CMOS circuit
B81C2203/0735 (Post-cmos, i.e. forming the micromechanical structure after the cmos circuit) appears on 293 US grants and 292 published applications in this corpus.
Search patents in B81C- Granted patents
- 293
- Published applications
- 292
- Assignees
- 140
- Inventors
- 516
- Latest grant
- 10 Mar 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1990 | 1 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 2 | 0 |
| 1996 | 3 | 0 |
| 1997 | 3 | 0 |
| 1998 | 5 | 0 |
| 1999 | 2 | 0 |
| 2000 | 7 | 0 |
| 2001 | 7 | 1 |
| 2002 | 6 | 5 |
| 2003 | 9 | 9 |
| 2004 | 9 | 14 |
| 2005 | 7 | 4 |
| 2006 | 5 | 9 |
| 2007 | 8 | 6 |
| 2008 | 5 | 6 |
| 2009 | 5 | 14 |
| 2010 | 10 | 6 |
| 2011 | 7 | 21 |
| 2012 | 13 | 11 |
| 2013 | 15 | 13 |
| 2014 | 10 | 12 |
| 2015 | 14 | 19 |
| 2016 | 23 | 22 |
| 2017 | 14 | 22 |
| 2018 | 19 | 20 |
| 2019 | 19 | 15 |
| 2020 | 19 | 15 |
| 2021 | 10 | 12 |
| 2022 | 10 | 10 |
| 2023 | 11 | 7 |
| 2024 | 4 | 8 |
| 2025 | 9 | 7 |
| 2026 | 2 | 4 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- CMOS ultrasonic transducers and related apparatus and methods10 Mar 2026US 12,569,880 B2Bfly Operations, Inc.
- Micro-electro mechanical system and manufacturing method thereof24 Feb 2026US 12,559,362 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Antenna apparatus16 Dec 2025US 12,500,328 B2Sofant Technologies Ltd
- Interconnection for monolithically integrated stacked devices and methods of forming thereof17 Jun 2025US 12,330,189 B2Globalfoundries Singaporepte. Ltd.
- Device for protecting FEOL element and BEOL element13 May 2025US 12,297,103 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Mems device built using the beol metal layers of a solid state semiconductor process16 Jul 2026US 2026/0200722 A1Nanusens SL
- Cmos ultrasonic transducers and related apparatus and methods9 Jul 2026US 2026/0192332 A1Bfly Operations, Inc.
- Micro-electro mechanical system and manufacturing method thereof4 Jun 2026US 2026/0152385 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Micro-electro-mechanical system device and manufacturing methods of mems device and semiconductor device2 Apr 2026US 2026/0091975 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Mems structure with reduced peeling and methods forming the same20 Nov 2025US 2025/0353735 A1Taiwan Semiconductor Manufacturing Company.Ltd
Most cited
By later US patents
- Polycrystalline silicon germanium films for forming micro-electromechanical systems226US 6,210,988 B1The Regents of the University of California · 2001
- Method of micromachining an integrated sensor on the surface of a silicon wafer130US 5,427,975 ADelco Electronics Corporation · 1995
- Piezoelectric MEMS integration with GaN technology116US 7,514,759 B1HRL Laboratories, LLC · 2009
- Polycrystalline silicon-germanium films for micro-electromechanical systems application113US 6,448,622 B1The Regents of the University of California · 2002
- Planar microshells for vacuum encapsulated devices and damascene method of manufacture94US 7,923,790 B1Silicon Laboratories Inc. · 2011