B81C 1/0096
For avoiding stiction when the device is in use, i.e. after manufacture
Official title: {For avoiding stiction when the device is in use, i.e. after manufacture has been completed}
B81C1/0096 (For avoiding stiction when the device is in use, i.e. after manufacture) appears on 188 US grants and 208 published applications in this corpus.
Search patents in B81C- Granted patents
- 188
- Published applications
- 208
- Assignees
- 90
- Inventors
- 393
- Latest grant
- 14 Jul 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1994 | 1 | 0 |
| 1995 | 2 | 0 |
| 1996 | 3 | 0 |
| 1997 | 4 | 0 |
| 1998 | 0 | 0 |
| 1999 | 1 | 0 |
| 2000 | 3 | 0 |
| 2001 | 1 | 2 |
| 2002 | 3 | 3 |
| 2003 | 5 | 9 |
| 2004 | 7 | 11 |
| 2005 | 9 | 12 |
| 2006 | 3 | 4 |
| 2007 | 6 | 9 |
| 2008 | 10 | 7 |
| 2009 | 9 | 8 |
| 2010 | 4 | 1 |
| 2011 | 4 | 4 |
| 2012 | 2 | 2 |
| 2013 | 1 | 4 |
| 2014 | 3 | 15 |
| 2015 | 14 | 9 |
| 2016 | 9 | 6 |
| 2017 | 7 | 9 |
| 2018 | 8 | 11 |
| 2019 | 13 | 14 |
| 2020 | 10 | 14 |
| 2021 | 8 | 9 |
| 2022 | 12 | 12 |
| 2023 | 14 | 10 |
| 2024 | 7 | 6 |
| 2025 | 3 | 11 |
| 2026 | 2 | 6 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Method for structural layer fabrication in micromechanical devices14 Jul 2026US 12,679,723 B2Murata Manufacturing Co., Ltd.
- MEMS device, method for manufacturing MEMS device and electronic device10 Mar 2026US 12,570,519 B2Beijing BOE Technology Development Co., Ltd.
- Anti-stiction bottom cavity surface for micromachined ultrasonic transducer devices1 Apr 2025US 12,263,506 B2Bfly Operations, Inc.
- MEMS capacitance microphone and manufacturing method thereof11 Mar 2025US 12,250,519 B2Qsensing Microelectronics Co., Ltd
- Piezoelectric anti-stiction structure for microelectromechanical systems4 Feb 2025US 12,215,016 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Out-of-plane micro-electromechanical device with reinforced stopper and method for manufacturing a micro-electromechanical device25 Jun 2026US 2026/0176126 A1STMicroelectronics International N. V.
- Anti-Stiction Process for Mems Device14 May 2026US 2026/0132019 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Roughness selectivity for mems movement stiction reduction19 Feb 2026US 2026/0048979 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Semiconductor mems structure and method of forming the same8 Jan 2026US 2026/0008667 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Capacitive sensor and method for manufacturing same8 Jan 2026US 2026/0008668 A1Murata Manufacturing Co., Ltd.
Most cited
By later US patents
- Low reset voltage process for DMD363US 5,331,454 ATexas Instruments Incorporated · 1994
- Method of producing micromechanical devices273US 5,411,769 ATexas Instruments Incorporated · 1995
- CMOS-MEMS device structure, bonding mesa structure and associated method235US 9,656,852 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2017
- PFPE coatings for micro-mechanical devices122US 5,512,374 ATexas Instruments Incorporated · 1996
- Method of unsticking components of micro-mechanical devices117US 5,482,564 ATexas Instruments Incorporated · 1996