B81C 1/00976
Control methods for avoiding stiction
Official title: {Control methods for avoiding stiction, e.g. controlling the bias voltage}
B81C1/00976 (Control methods for avoiding stiction) appears on 27 US grants and 28 published applications in this corpus.
Search patents in B81C- Granted patents
- 27
- Published applications
- 28
- Assignees
- 25
- Inventors
- 55
- Latest grant
- 19 Dec 2023
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1995 | 1 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 0 | 0 |
| 1999 | 0 | 0 |
| 2000 | 0 | 0 |
| 2001 | 0 | 1 |
| 2002 | 0 | 0 |
| 2003 | 2 | 1 |
| 2004 | 0 | 0 |
| 2005 | 0 | 0 |
| 2006 | 0 | 0 |
| 2007 | 0 | 0 |
| 2008 | 0 | 0 |
| 2009 | 1 | 0 |
| 2010 | 0 | 0 |
| 2011 | 0 | 3 |
| 2012 | 1 | 0 |
| 2013 | 1 | 2 |
| 2014 | 0 | 6 |
| 2015 | 6 | 3 |
| 2016 | 0 | 1 |
| 2017 | 5 | 2 |
| 2018 | 3 | 2 |
| 2019 | 1 | 2 |
| 2020 | 1 | 1 |
| 2021 | 3 | 0 |
| 2022 | 0 | 1 |
| 2023 | 2 | 1 |
| 2024 | 0 | 0 |
| 2025 | 0 | 2 |
By publication year. Applications have been published since 2001.
Recent patents
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- Vibration device and method for controlling the same17 Aug 2021US 11,092,440 B2Kabushiki Kaisha Toshiba
- MEMS device with stiction recover and methods30 Mar 2021US 10,961,119 B1mCube Inc.
- Vertical stopper for capping MEMS devices5 Jan 2021US 10,882,735 B2Analog Devices, Inc.
- Reliable and Robust Zero Power Micro-Mechanical Switch7 Aug 2025US 2025/0250159 A1Zepsor Technologies, Inc.
- Mems switch, driving method thereof, and electronic device24 Apr 2025US 2025/0132747 A1Beijing BOE Technology Development Co., Ltd.
- MEMS Structure and Method of Forming Same2 Nov 2023US 2023/0353066 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Physical quantity sensor and inertial measurement unit28 Apr 2022US 2022/0128590 A1Seiko Epson Corporation
- MEMS Structure and Method of Forming Same27 Feb 2020US 2020/0067425 A1Taiwan Semiconductor Manufacturing Company.Ltd
Most cited
By later US patents
- CMOS-MEMS device structure, bonding mesa structure and associated method235US 9,656,852 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2017
- Elimination of sticking of micro-mechanical devices77US 5,412,186 ATexas Instruments Incorporated · 1995
- MEMS structure and method of forming same50US 9,065,358 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2015
- Micromechanical device and method for non-contacting edge-coupled operation32US 6,583,921 B2Texas Instruments Incorporated · 2003
- Method of anodically bonding a multilayer device with a free mass13US 6,548,321 B1The Charles Stark Draper Laboratory, Inc. · 2003