MEMS structure and method of forming same
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsYi Heng Tsai, Chia-Hua Chu, Kuei-Sung Chang
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Abstract
A microelectromechanical system (MEMS) device that reduces or eliminates stiction includes a substrate and a movable element at least partially suspended above the substrate and having at least one degree of freedom. A protrusion extends from the substrate and is configured to contact the movable element when the moving element moves in the at least one degree of freedom. The protrusion comprises a surface having a low surface energy relative a silicon oxide surface. The protrusion may be coupled to a voltage potential node to avoid or counteract electrostatic forces.
Claims14
A microelectromechanical system (MEMS) device comprising:
- a first substrate comprising a plurality of interconnect layers embedded in a respective plurality of stacked dielectric layers and having a topmost dielectric layer, the topmost dielectric layer having a topmost surface and defining a cavity having a floor;
- a second substrate mounted atop the first substrate and bonded to the topmost dielectric layer, the second substrate comprising a movable element at least partially suspended above the cavity;
- and
- a protrusion extending from the floor of the cavity and having a topmost surface below the topmost of the topmost dielectric layer, the protrusion being positioned to engage the movable element when the movable element is deflected, the protrusion comprising a conductive element electrically coupled to one of the interconnect layers;
- and
- a via extending from a first side of the second substrate and extending through the second substrate to a second side of the second substrate and further extending through the topmost dielectric layer, the via having a conductor therein that physically contacts an interconnect embedded in a dielectric layer of the plurality of stacked dielectric layers, the conductor of the via electrically coupling an element on the second substrate to an element of the first substrate.
A microelectromechanical system (MEMS) device comprising:
- a first substrate;
- a plurality of dielectric layers atop the first substrate, a topmost of the plurality of dielectric layers comprising a bonding layer having a top surface and having a cavity formed therein;
- a plurality of interconnect layers embedded in respective ones of the plurality of dielectric layers;
- a second substrate bonded to the bonding layer;
- a movable element formed at least in part in the second substrate and having at least one degree of freedom defining a motion path;
- a protrusion extending from a floor of the cavity and located in the motion path of the movable element, the protrusion being contained entirely within the cavity in the bonding layer;
- a via extending from a first side of the second substrate and extending through the second substrate to a second side of the second substrate and further extending through the bonding layer to electrically contacting a contact formed atop a dielectric layer of the plurality of dielectric layers;
- and
- an electrical path between the protrusion and at least one of the interconnect layers.
Dependencies are inferred from the claim text.