B81C 1/00968
Methods for breaking the stiction bond
Official title: {Methods for breaking the stiction bond}
B81C1/00968 (Methods for breaking the stiction bond) appears on 54 US grants and 69 published applications in this corpus.
Search patents in B81C- Granted patents
- 54
- Published applications
- 69
- Assignees
- 35
- Inventors
- 135
- Latest grant
- 14 Jul 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1996 | 1 | 0 |
| 1997 | 0 | 0 |
| 1998 | 0 | 0 |
| 1999 | 0 | 0 |
| 2000 | 1 | 0 |
| 2001 | 0 | 0 |
| 2002 | 1 | 0 |
| 2003 | 1 | 1 |
| 2004 | 2 | 4 |
| 2005 | 3 | 1 |
| 2006 | 1 | 0 |
| 2007 | 0 | 2 |
| 2008 | 1 | 0 |
| 2009 | 0 | 0 |
| 2010 | 1 | 0 |
| 2011 | 0 | 0 |
| 2012 | 0 | 1 |
| 2013 | 0 | 1 |
| 2014 | 0 | 2 |
| 2015 | 2 | 3 |
| 2016 | 4 | 2 |
| 2017 | 0 | 4 |
| 2018 | 0 | 1 |
| 2019 | 4 | 3 |
| 2020 | 3 | 7 |
| 2021 | 5 | 6 |
| 2022 | 9 | 10 |
| 2023 | 8 | 7 |
| 2024 | 4 | 3 |
| 2025 | 2 | 6 |
| 2026 | 1 | 5 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Method for structural layer fabrication in micromechanical devices14 Jul 2026US 12,679,723 B2Murata Manufacturing Co., Ltd.
- MEMS capacitance microphone and manufacturing method thereof11 Mar 2025US 12,250,519 B2Qsensing Microelectronics Co., Ltd
- Piezoelectric anti-stiction structure for microelectromechanical systems4 Feb 2025US 12,215,016 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Anti-stiction enhancement of ruthenium contact24 Dec 2024US 12,172,888 B2Qorvo US, Inc.
- Mems inertial sensor with high resistance to stiction15 Oct 2024US 12,117,464 B2STMicroelectronics S,r.l.
- Out-of-plane micro-electromechanical device with reinforced stopper and method for manufacturing a micro-electromechanical device25 Jun 2026US 2026/0176126 A1STMicroelectronics International N. V.
- Roughness selectivity for mems movement stiction reduction19 Feb 2026US 2026/0048979 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Semiconductor mems structure and method of forming the same8 Jan 2026US 2026/0008667 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Capacitive sensor and method for manufacturing same8 Jan 2026US 2026/0008668 A1Murata Manufacturing Co., Ltd.
- Functionalized oxoacid lubricants in mems devices1 Jan 2026US 2026/0001755 A1Texas Instruments Incorporated
Most cited
By later US patents
- Method of unsticking components of micro-mechanical devices117US 5,482,564 ATexas Instruments Incorporated · 1996
- Accelerometer integrity alert77US 9,522,276 B2Medtronic, Inc. · 2016
- Micro-electromechanical device43US 6,127,765 ATokyo Institute of Technology · 2000
- Systems and methods for overcoming stiction33US 6,856,068 B2PTS Corporation · 2005
- Method and apparatus for stress pulsed release and actuation of micromechanical structures12US 6,433,463 B1Wisconsin Alumni Research Foundation · 2002