B81C 1/00349
Creating layers of material on a substrate
Official title: {Creating layers of material on a substrate}
B81C1/00349 (Creating layers of material on a substrate) appears on 551 US grants and 648 published applications in this corpus.
Search patents in B81C- Granted patents
- 551
- Published applications
- 648
- Assignees
- 315
- Inventors
- 1,217
- Latest grant
- 15 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1993 | 1 | 0 |
| 1994 | 1 | 0 |
| 1995 | 2 | 0 |
| 1996 | 2 | 0 |
| 1997 | 0 | 0 |
| 1998 | 1 | 0 |
| 1999 | 2 | 0 |
| 2000 | 16 | 0 |
| 2001 | 9 | 2 |
| 2002 | 14 | 23 |
| 2003 | 14 | 25 |
| 2004 | 18 | 24 |
| 2005 | 16 | 17 |
| 2006 | 14 | 20 |
| 2007 | 16 | 15 |
| 2008 | 8 | 14 |
| 2009 | 6 | 17 |
| 2010 | 11 | 12 |
| 2011 | 10 | 24 |
| 2012 | 11 | 21 |
| 2013 | 14 | 25 |
| 2014 | 21 | 40 |
| 2015 | 36 | 60 |
| 2016 | 34 | 55 |
| 2017 | 44 | 32 |
| 2018 | 49 | 40 |
| 2019 | 31 | 43 |
| 2020 | 35 | 30 |
| 2021 | 38 | 29 |
| 2022 | 22 | 24 |
| 2023 | 21 | 12 |
| 2024 | 16 | 16 |
| 2025 | 10 | 17 |
| 2026 | 8 | 11 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Method for creating surface microstructures15 Sep 2026US 12,736,723 B2Rolic Technologies AG
- Multi-level mems process18 Aug 2026US 12,709,540 B2InvenSense, Inc.
- Atomic-smooth device with microstructure, and method for preparing same7 Jul 2026US 12,673,866 B2
- Process for manufacturing a microelectromechanical mirror device and microelectromechanical mirror device5 May 2026US 12,619,065 B2STMicroelectronics S,r.l.
- Production of pigments having a defined size and shape21 Apr 2026US 12,606,708 B2Giesecke+Devrient Currency Technology GmbH
- Method for producing a silicon layer system with electrical connections27 Aug 2026US 2026/0250122 A1
- Dual micro-electro mechanical system and manufacturing method thereof23 Jul 2026US 2026/0209033 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Micro-electro-mechanical system-based material corrosion electrochemical measurement sensor, preparation method therefor, and material corrosion electrochemical measurement equipment25 Jun 2026US 2026/0177474 A1University of Science and Technology Beijing
- Method for manufacturing an electronic device11 Jun 2026US 2026/0159381 A1Commissariat A L' Energie Atomique Et Aux Energies Alternatives
- Anti-Stiction Process for Mems Device14 May 2026US 2026/0132019 A1Taiwan Semiconductor Manufacturing Company.Ltd
Most cited
By later US patents
- Controlled cleavage process and device for patterned films426US 5,985,742 ASilicon Genesis Corporation · 1999
- Controlled cleavage process and device for patterned films344US 6,528,391 B1Silicon Genesis Corporation · 2003
- Method of fabricating vertical integrated circuits333US 6,875,671 B2Reveo, Inc. · 2005
- Method of room temperature covalent bonding315US 7,109,092 B2Ziptronix, Inc. · 2006
- Semiconductor device including eutectic bonding portion and method for manufacturing the same314US 6,555,901 B1Denso Corporation · 2003