B81C 1/00357
Involving bonding one or several substrates on a non-temporary support
Official title: {involving bonding one or several substrates on a non-temporary support, e.g. another substrate}
B81C1/00357 (Involving bonding one or several substrates on a non-temporary support) appears on 157 US grants and 196 published applications in this corpus.
Search patents in B81C- Granted patents
- 157
- Published applications
- 196
- Assignees
- 106
- Inventors
- 390
- Latest grant
- 7 Jul 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2000 | 1 | 0 |
| 2001 | 2 | 1 |
| 2002 | 6 | 10 |
| 2003 | 5 | 12 |
| 2004 | 12 | 12 |
| 2005 | 8 | 6 |
| 2006 | 5 | 6 |
| 2007 | 4 | 1 |
| 2008 | 2 | 3 |
| 2009 | 0 | 4 |
| 2010 | 3 | 3 |
| 2011 | 8 | 4 |
| 2012 | 4 | 7 |
| 2013 | 3 | 5 |
| 2014 | 3 | 12 |
| 2015 | 12 | 20 |
| 2016 | 7 | 13 |
| 2017 | 9 | 7 |
| 2018 | 10 | 8 |
| 2019 | 9 | 17 |
| 2020 | 6 | 8 |
| 2021 | 14 | 8 |
| 2022 | 8 | 9 |
| 2023 | 7 | 7 |
| 2024 | 2 | 5 |
| 2025 | 5 | 5 |
| 2026 | 2 | 3 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Atomic-smooth device with microstructure, and method for preparing same7 Jul 2026US 12,673,866 B2
- Dual micro-electro mechanical system and manufacturing method thereof7 Apr 2026US 12,595,167 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Method for preparing the remainder of a donor substrate, substrate produced by said method, and use of such a substrate18 Nov 2025US 12,473,198 B2Soitec
- MEMS sensor with particle filter and method for producing it16 Sep 2025US 12,415,719 B2Infineon Technologies AG
- Methods for ultrasonic fabrication and sealing of microfluidics15 Jul 2025US 12,358,786 B2National Centre for Scientific Research Demokritos
- Dual micro-electro mechanical system and manufacturing method thereof23 Jul 2026US 2026/0209033 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Method for manufacturing an electronic device11 Jun 2026US 2026/0159381 A1Commissariat A L' Energie Atomique Et Aux Energies Alternatives
- Anti-Stiction Process for Mems Device14 May 2026US 2026/0132019 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Mems sensor with particle filter and method for producing it11 Dec 2025US 2025/0376370 A1Infineon Technologies AG
- Method for assembling two substrates by molecular adhesion and structure obtained by such a method14 Aug 2025US 2025/0256955 A1
Most cited
By later US patents
- Method of room temperature covalent bonding315US 7,109,092 B2Ziptronix, Inc. · 2006
- Semiconductor device including eutectic bonding portion and method for manufacturing the same314US 6,555,901 B1Denso Corporation · 2003
- Method of room temperature covalent bonding215US 8,841,002 B2Ziptronix, Inc. · 2014
- Methods for forming openings in a substrate and apparatuses with these openings and methods for creating assemblies with openings201US 6,479,395 B1Alien Technology Corporation · 2002
- Micromachined electrical field-flow fractionation system93US 6,136,171 AUniversity of Utah Research Foundation · 2000