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US 12,415,719 B2Granted
MEMS sensor with particle filter and method for producing it
AssigneeInfineon Technologies AG
InventorsAndre Brockmeier, Barbara Angela Glanzer, Marten Oldsen, Francesco Solazzi, Carsten Von Koblinski
Life of this patent
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Abstract
The semiconductor device includes a microelectromechanical system (MEMS) chip having a first main surface and a second main surface situated opposite the first main surface, a first glass-based substrate, on which the MEMS chip is arranged by its first main surface, and a second substrate, which is arranged on the second main surface of the MEMS chip, wherein the MEMS chip has a first recess connected to the surroundings by way of a plurality of perforation holes arranged in the first substrate.
Claims19
A semiconductor device, comprising:
- a microelectromechanical system (MEMS) chip having a first main surface and a second main surface situated opposite the first main surface;
- a first glass-based substrate, on which the first main surface of the MEMS chip is arranged, wherein the first glass-based substrate includes a plurality of perforation holes;
- a second substrate which is arranged on the second main surface of the MEMS chip,
- wherein the first main surface of the MEMS chip has a first recess connected to an external environment by way of the plurality of perforation holes that extend through the first glass-based substrate between the first recess and the external environment,
- wherein the second substrate has a second recess that is situated opposite the first recess of the MEMS chip and forms a back volume for the MEMS chip,
- wherein the MEMS chip has a membrane situated between the first recess and the second recess,
- wherein the first glass-based substrate includes a first through connection that extends through the first glass-based substrate,
- wherein the MEMS chip has a second through connection that extends through the MEMS chip, in alignment with the first through connection;
- and
- a metallization that extends from the second main surface of the MEMS chip, through the first through connection, and through the second through connection.
7 more elements
A semiconductor device, comprising:
- a microelectromechanical system (MEMS) chip having a first main surface and a second main surface situated opposite the first main surface;
- a first glass-based substrate, on which the first main surface of the MEMS chip is arranged, wherein the first glass-based substrate comprises a first portion and a second portion, wherein the second portion is thinner than the first portion and includes a plurality of perforation holes, wherein the first portion and the second portion of the first glass-based substrate have a common planar surface, and wherein the first main surface of the MEMS chip is arranged on the common planar surface of the first portion and the second portion of the first glass-based substrate;
- a second substrate which is arranged on the second main surface of the MEMS chip,
- wherein the first main surface of the MEMS chip has a first recess connected to an external environment by way of the plurality of perforation holes that extend through the first glass-based substrate between the first recess and the external environment,
- wherein the second substrate has a second recess that is situated opposite the first recess of the MEMS chip and forms a back volume for the MEMS chip,
- wherein the MEMS chip has a semiconductor membrane situated between the first recess and the second recess,
- wherein the first glass-based substrate includes a first through connection that extends through the first glass-based substrate,
- wherein the MEMS chip has a second through connection that extends through the MEMS chip, in alignment with the first through connection;
- and
- a metallization that extends from the second main surface of the MEMS chip, through the first through connection, and through the second through connection.
7 more elements
Dependencies are inferred from the claim text.