B81B 3/0067
Mechanical properties
Official title: {Mechanical properties}
B81B3/0067 (Mechanical properties) appears on 1,069 US grants and 1,287 published applications in this corpus.
Search patents in B81B- Granted patents
- 1,069
- Published applications
- 1,287
- Assignees
- 417
- Inventors
- 2,115
- Latest grant
- 8 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1991 | 1 | 0 |
| 1992 | 1 | 0 |
| 1993 | 1 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 2 | 0 |
| 1997 | 3 | 0 |
| 1998 | 6 | 0 |
| 1999 | 10 | 0 |
| 2000 | 6 | 0 |
| 2001 | 7 | 6 |
| 2002 | 10 | 23 |
| 2003 | 18 | 30 |
| 2004 | 25 | 22 |
| 2005 | 15 | 27 |
| 2006 | 27 | 29 |
| 2007 | 18 | 56 |
| 2008 | 25 | 28 |
| 2009 | 28 | 50 |
| 2010 | 33 | 46 |
| 2011 | 32 | 43 |
| 2012 | 32 | 48 |
| 2013 | 39 | 56 |
| 2014 | 60 | 61 |
| 2015 | 51 | 75 |
| 2016 | 60 | 63 |
| 2017 | 63 | 77 |
| 2018 | 64 | 77 |
| 2019 | 61 | 66 |
| 2020 | 71 | 60 |
| 2021 | 53 | 67 |
| 2022 | 49 | 50 |
| 2023 | 58 | 79 |
| 2024 | 57 | 61 |
| 2025 | 53 | 53 |
| 2026 | 30 | 34 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Microscale flexible strain sensor8 Sep 2026US 12,729,106 B2Carnegie Mellon University
- Anchor structure8 Sep 2026US 12,729,107 B2Lawrence Semiconductor Research Laboratory, Inc.
- Movable device, MEMS device and optical scanning apparatus8 Sep 2026US 12,730,301 B2Mitsumi Electric Co., Ltd.
- Micro-electro-mechanical system device1 Sep 2026US 12,722,968 B2Vanguard International Semiconductor Corporation
- Semiconductor device18 Aug 2026US 12,709,537 B2Infineon Technologies AG
- Anchor structure1 Oct 2026US 2026/0296876 A1Lawrence Semiconductor Research Laboratory, Inc.
- Mems bridge24 Sep 2026US 2026/0290715 A1Sofant Technologies Ltd
- Semiconductor device17 Sep 2026US 2026/0274648 A1Infineon Technologies AG
- Method for producing a microstructural element and microstructural element10 Sep 2026US 2026/0265049 A1Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e. V.
- Micromechanical component for a sensor device, microphone device and/or micro-loudspeaker device27 Aug 2026US 2026/0250121 A1
Most cited
By later US patents
- Support post architecture for micromechanical devices340US 6,447,126 B1Texas Instruments Incorporated · 2002
- Microelectromechanical device having a stiffened support beam, and methods of forming stiffened support beams in MEMS294US 6,632,698 B2Hewlett-Packard Development Company, L. P. · 2003
- Support post architecture for micromechanical devices283US 5,650,881 ATexas Instruments Incorporated · 1997
- Design and fabrication of broadband surface-micromachined micro-electro-mechanical switches for microwave and millimeter-wave applications270US 6,046,659 AHughes Electronics Corporation · 2000
- Miniature silicon condenser microphone268US 5,870,482 AKnowles Electronics, LLC · 1999