B81B 3/0078
Constitution or structural means for improving mechanical properties not provided for in
Official title: {Constitution or structural means for improving mechanical properties not provided for in B81B3/007 - B81B3/0075}
B81B3/0078 (Constitution or structural means for improving mechanical properties not provided for in) appears on 176 US grants and 213 published applications in this corpus.
Search patents in B81B- Granted patents
- 176
- Published applications
- 213
- Assignees
- 116
- Inventors
- 439
- Latest grant
- 18 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1996 | 1 | 0 |
| 1997 | 0 | 0 |
| 1998 | 1 | 0 |
| 1999 | 2 | 0 |
| 2000 | 0 | 0 |
| 2001 | 1 | 0 |
| 2002 | 0 | 3 |
| 2003 | 1 | 10 |
| 2004 | 3 | 4 |
| 2005 | 3 | 2 |
| 2006 | 6 | 1 |
| 2007 | 2 | 7 |
| 2008 | 4 | 4 |
| 2009 | 4 | 13 |
| 2010 | 4 | 10 |
| 2011 | 7 | 6 |
| 2012 | 8 | 13 |
| 2013 | 7 | 6 |
| 2014 | 13 | 15 |
| 2015 | 12 | 13 |
| 2016 | 11 | 12 |
| 2017 | 10 | 12 |
| 2018 | 7 | 12 |
| 2019 | 8 | 13 |
| 2020 | 15 | 8 |
| 2021 | 11 | 8 |
| 2022 | 7 | 6 |
| 2023 | 5 | 10 |
| 2024 | 8 | 9 |
| 2025 | 10 | 9 |
| 2026 | 5 | 7 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Semiconductor device18 Aug 2026US 12,709,537 B2Infineon Technologies AG
- Device with a stress decoupling structure18 Aug 2026US 12,709,538 B2Infineon Technologies AG
- MEMS device21 Jul 2026US 12,686,613 B2AAC Technologies PTE.Ltd.
- MEMS die and MEMS-based sensor17 Feb 2026US 12,552,659 B2Knowles Electronics, LLC
- Pressure sensor and method for manufacturing same, and electronic device3 Feb 2026US 12,540,869 B2Beijing BOE Technology Development Co., Ltd.
- Semiconductor device17 Sep 2026US 2026/0274648 A1Infineon Technologies AG
- Micromechanical component for a capacitive sensor and/or actuator device16 Jul 2026US 2026/0200724 A1
- Microelectromechanical array4 Jun 2026US 2026/0152387 A1Zilltek Technology Corp.
- Piezoelectric microelectromechanical device with anchor reinforcement14 May 2026US 2026/0132016 A1QUALCOMM Incorporated
- Mems device9 Apr 2026US 2026/0097951 A1Infineon Technologies AG
Most cited
By later US patents
- Accelerometer sensor of crystalline material and method for manufacturing the same160US 5,578,755 ARobert Bosch GmbH · 1996
- Adjusting operating characteristics of micromachined torsional oscillators132US 5,969,465 AXROS, Inc. · 1999
- Micromachined device with enhanced dimensional control91US 6,282,960 B1Analog Devices, Inc. · 2001
- MEMS device having a layer movable at asymmetric rates51US 7,550,810 B2QUALCOMM MEMS Technologies, Inc. · 2009
- Micromechanical device and method of manufacturing micromechanical device51US 7,972,884 B2Kabushiki Kaisha Toshiba · 2011