B24B 37/24
Characterised by the composition or properties of the pad materials
Official title: characterised by the composition or properties of the pad materials
B24B37/24 (Characterised by the composition or properties of the pad materials) appears on 971 US grants and 1,264 published applications in this corpus.
Search patents in B24B- Granted patents
- 971
- Published applications
- 1,264
- Assignees
- 311
- Inventors
- 1,906
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1988 | 1 | 0 |
| 1989 | 1 | 0 |
| 1990 | 1 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 1 | 0 |
| 1994 | 0 | 0 |
| 1995 | 1 | 0 |
| 1996 | 0 | 0 |
| 1997 | 4 | 0 |
| 1998 | 13 | 0 |
| 1999 | 21 | 0 |
| 2000 | 36 | 0 |
| 2001 | 35 | 22 |
| 2002 | 56 | 61 |
| 2003 | 53 | 49 |
| 2004 | 43 | 72 |
| 2005 | 45 | 51 |
| 2006 | 36 | 50 |
| 2007 | 34 | 42 |
| 2008 | 24 | 38 |
| 2009 | 23 | 44 |
| 2010 | 17 | 31 |
| 2011 | 12 | 34 |
| 2012 | 36 | 46 |
| 2013 | 34 | 40 |
| 2014 | 20 | 32 |
| 2015 | 32 | 55 |
| 2016 | 37 | 57 |
| 2017 | 30 | 48 |
| 2018 | 43 | 60 |
| 2019 | 48 | 44 |
| 2020 | 29 | 50 |
| 2021 | 26 | 56 |
| 2022 | 22 | 47 |
| 2023 | 52 | 66 |
| 2024 | 42 | 61 |
| 2025 | 30 | 63 |
| 2026 | 33 | 45 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Curable composition and abrasive articles made using the same6 Oct 2026US 12,753,266 B23M Innovative Properties Company
- Membrane coating compound for chemical mechanical polishing process, membrane including the same, and polishing apparatus including the same15 Sep 2026US 12,734,637 B2Samsung Electronics Co., Ltd.
- Polishing pad and method for manufacturing semiconductor device using the same1 Sep 2026US 12,722,246 B2Enpulse Co., Ltd.
- Polishing pad and method for manufacturing polishing pad1 Sep 2026US 12,722,247 B2Fujibo Holdings, Inc.
- Environment-friendly polishing disc and processing technology thereof11 Aug 2026US 12,703,060 B2
- Polishing pad and method for polishing object to be polished1 Oct 2026US 2026/0295770 A1Kureha Corporation
- Polishing pad and method for polishing object to be polished1 Oct 2026US 2026/0295771 A1Kureha Corporation
- Polishing slurry, polishing system, and method for polishing semiconductor substrate1 Oct 2026US 2026/0297384 A1
- Polishing pad24 Sep 2026US 2026/0284828 A1Hubei Dinghui Microelectronics Materials Co., Ltd
- Polishing pad, polishing tool, polishing apparatus, and polishing method24 Sep 2026US 2026/0284829 A1Canon Kabushiki Kaisha
Most cited
By later US patents
- Method for chemical-mechanical planarization of a substrate on a fixed-abrasive polishing pad195US 5,972,792 AMicron Technology, Inc. · 1999
- Method and apparatus for mechanical and chemical-mechanical planarization of microelectronic-device substrate assemblies182US 6,039,633 AMicron Technology, Inc. · 2000
- Polishing pad and a method for making a polishing pad with covalently bonded particles174US 5,624,303 AMicron Technology, Inc. · 1997
- Abrasive construction for semiconductor wafer modification151US 5,692,950 AMinnesota Mining and Manufacturing Company · 1997
- Apparatus and method for refurbishing fixed-abrasive polishing pads used in chemical-mechanical planarization of semiconductor wafers148US 5,782,675 AMicron Technology, Inc. · 1998