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US 12,722,247 B2Granted
Polishing pad and method for manufacturing polishing pad
AssigneeFujibo Holdings, Inc.
InventorsTeppei Tateno, Keisuke Tanaka, Yoshie Kiraku, Kenichi Koike, Hiroshi Kurihara, Yoshiki Miyauchi
Life of this patent
Estimating the term…
Abstract
The present invention provides a polishing pad that can suppress variations in light transmittance or a polishing pad that can reduce adhesion and sticking of polishing swarf to the surface on the polishing surface side of the light-transmitting resin member (window member).
Claims20
A polishing pad comprising:
- a light-transmitting member;
- and
- a polishing layer, wherein
- the polishing layer includes a polishing surface for polishing an object to be polished, and the polishing pad includes a through hole penetrating from the polishing surface to an opposite surface thereof,
- the light-transmitting member is arranged so that the light-transmitting member is in the through hole when viewed from the polishing surface side of the polishing pad in a thickness direction of the polishing pad,
- a water contact angle of a surface on the polishing surface side of the light-transmitting member is 80 degrees or less, and
- a surface of the light-transmitting member opposite to the polishing surface has a water contact angle greater than 80 degrees.
4 more elements
A polishing pad comprising:
- a light-transmitting member;
- and
- a polishing layer, wherein
- the polishing layer includes a polishing surface for polishing an object to be polished, and the polishing pad includes a through hole penetrating from the polishing surface to an opposite surface thereof,
- the light-transmitting member is arranged so that the light-transmitting member is in the through hole when viewed from the polishing surface side of the polishing pad in a thickness direction of the polishing pad,
- a surface on the polishing surface side of the light-transmitting member is coated with a hydrophilic resin, and the hydrophilic resin is a resin having an ion-bonding hydrophilic group, and
- in the resin having an ion-bonding hydrophilic group, a cationic moiety of the ion-bonding hydrophilic group is covalently bonded to a monomer constituting the resin and is ion-bonded to an anionic moiety of the ion-bonding hydrophilic group.
4 more elements
A polishing pad comprising:
- a light-transmitting resin member;
- and
- a polishing layer, wherein
- the polishing layer includes a polishing surface for polishing an object to be polished, and the polishing pad includes a through hole penetrating from the polishing surface to an opposite surface thereof,
- the light-transmitting resin member is arranged so that the light-transmitting resin member is in the through hole when viewed from the polishing surface side of the polishing pad in a thickness direction of the polishing pad, and
- (iii) the light-transmitting resin member includes a hydrophilic monomer graft-polymerized on a surface on the polishing surface side thereof, or
- (iv) the light-transmitting resin member includes, at least on a surface on the polishing surface side thereof, a resin containing a structural unit derived from a polyfunctional (meth) acrylate monomer having two or more polymerizable functional groups and having a —C2-4 alkylene-O-unit.
4 more elements
Dependencies are inferred from the claim text.