B24B 37/245
Pads with fixed abrasives
Official title: {Pads with fixed abrasives}
B24B37/245 (Pads with fixed abrasives) appears on 218 US grants and 251 published applications in this corpus.
Search patents in B24B- Granted patents
- 218
- Published applications
- 251
- Assignees
- 94
- Inventors
- 525
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1997 | 3 | 0 |
| 1998 | 6 | 0 |
| 1999 | 8 | 0 |
| 2000 | 6 | 0 |
| 2001 | 11 | 9 |
| 2002 | 19 | 13 |
| 2003 | 18 | 17 |
| 2004 | 15 | 14 |
| 2005 | 14 | 13 |
| 2006 | 9 | 8 |
| 2007 | 9 | 13 |
| 2008 | 4 | 5 |
| 2009 | 4 | 4 |
| 2010 | 1 | 7 |
| 2011 | 2 | 11 |
| 2012 | 5 | 18 |
| 2013 | 6 | 10 |
| 2014 | 8 | 9 |
| 2015 | 6 | 10 |
| 2016 | 8 | 9 |
| 2017 | 5 | 10 |
| 2018 | 9 | 12 |
| 2019 | 9 | 10 |
| 2020 | 4 | 9 |
| 2021 | 7 | 11 |
| 2022 | 4 | 5 |
| 2023 | 6 | 8 |
| 2024 | 6 | 4 |
| 2025 | 2 | 7 |
| 2026 | 4 | 5 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Curable composition and abrasive articles made using the same6 Oct 2026US 12,753,266 B23M Innovative Properties Company
- Abrasive articles and method of making the same19 May 2026US 12,629,798 B23M Innovative Properties Company
- Abrasive articles and methods for forming same14 Apr 2026US 12,600,892 B2Saint-Gobain Abrasives, Inc.
- Two component chemical mechanical polishing13 Jan 2026US 12,521,840 B2Wolfspeed, Inc.
- Buffing spherocylinder made of compressed material15 Apr 2025US 12,275,120 B2Lake Country Manufacturing, Inc.
- Polishing pad and method for polishing object to be polished1 Oct 2026US 2026/0295771 A1Kureha Corporation
- Abrasive articles and method of making the same20 Aug 2026US 2026/0241515 A13M Innovative Properties Company
- Substrate polishing apparatus28 May 2026US 2026/0145296 A1Samsung Electronics Co., Ltd.
- Slurry composition for chemical mechanical polishing, polishing pad for chemical mechanical polishing, and semiconductor device manufacturing method using the same28 May 2026US 2026/0146190 A1Samsung Electronics Co., Ltd.
- Two Component Chemical Mechanical Polishing19 Mar 2026US 2026/0077448 A1Wolfspeed, Inc.
Most cited
By later US patents
- Method for chemical-mechanical planarization of a substrate on a fixed-abrasive polishing pad195US 5,972,792 AMicron Technology, Inc. · 1999
- Polishing pad and a method for making a polishing pad with covalently bonded particles174US 5,624,303 AMicron Technology, Inc. · 1997
- Abrasive construction for semiconductor wafer modification151US 5,692,950 AMinnesota Mining and Manufacturing Company · 1997
- Apparatus and method for refurbishing fixed-abrasive polishing pads used in chemical-mechanical planarization of semiconductor wafers148US 5,782,675 AMicron Technology, Inc. · 1998
- Web-format polishing pads and methods for manufacturing and using web-format polishing pads in mechanical and chemical-mechanical planarization of microelectronic substrates145US 6,210,257 B1Micron Technology, Inc. · 2001