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US 2026/0145296 A1Published application
Substrate polishing apparatus
AssigneeSamsung Electronics Co., Ltd.
InventorsYuah SON, DONGHOON KWON
Life of this patent
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Abstract
A substrate polishing apparatus includes a polishing pad, a first light source that radiates first light to the polishing pad, a second light source that radiates second light to the polishing pad, and a lubricant supply device that supplies a lubricant to the polishing pad. The polishing pad includes a binder and photocatalytic particles in the binder.
Claims20
A substrate polishing apparatus comprising:
- a polishing pad;
- a first light source configured to radiate first light having a first wavelength on the polishing pad;
- a second light source configured to radiate second light having a second wavelength on the polishing pad;
- and
- a lubricant supply device configured to supply a lubricant to the polishing pad,
- wherein the polishing pad comprises:
- a binder;
- and
- a photocatalytic particle in the binder, and
- wherein the first wavelength of the first light is smaller than the second wavelength of the second light.
7 more elements
A substrate polishing apparatus comprising:
- a polishing pad;
- a light source configured to radiate light on the polishing pad;
- and
- a lubricant supply device configured to supply a lubricant to the polishing pad, wherein the polishing pad comprises:
- a binder;
- and
- a plurality of photocatalytic particles in the binder,
- wherein the binder comprises:
- a base part;
- a plurality of protrusions protruding from the base part;
- and
- a groove between adjacent protrusions, among the plurality of protrusions, and
- wherein the plurality of photocatalytic particles comprise:
- a plurality of first photocatalytic particles penetrating an upper surface of each of the plurality of protrusions;
- and
- a plurality of second photocatalytic particles penetrating a sidewall of each of the plurality of protrusions.
13 more elements
A substrate polishing apparatus comprising:
- a platen;
- a sub pad on the platen;
- a polishing pad on the sub pad;
- a first light source configured to radiate first light on the polishing pad;
- a second light source configured to radiate second light on the polishing pad;
- and
- a lubricant supply device configured to supply a lubricant to the polishing pad,
- wherein the polishing pad comprises:
- a binder;
- and
- a plurality of photocatalytic particles in the binder,
- wherein the binder comprises:
- a base part;
- and a plurality of protrusions protruding from the base part;
- and
- a groove between adjacent protrusions among the plurality of protrusions, and
- wherein the plurality of photocatalytic particles comprise:
- a plurality of first photocatalytic particles in the plurality of protrusions;
- and
- a plurality of second photocatalytic particles in the base part.
17 more elements
Dependencies are inferred from the claim text.