Abrasive construction for semiconductor wafer modification
AssigneeMinnesota Mining and Manufacturing Company
InventorsDenise R. Rutherford, Douglas P. Goetz, Cristina U. Thomas, Richard J. Webb, Wesley J. Bruxvoort, James D. Buhler, William J. Hollywood
Life of this patent
Estimating the term…
Abstract
An abrasive construction for modifying a surface of a workpiece, such as a semiconductor wafer. The abrasive construction comprises: a three-dimensional, textured, fixed abrasive element; at least one resilient element generally coextensive with the fixed abrasive element; and at least one rigid element generally coextensive with and interposed between the resilient element and the fixed abrasive element, wherein the rigid element has a Young's Modulus greater than that of the resilient element.
Claims30
An abrasive construction capable of substantially conforming to a workpiece surface global topography while not substantially conforming to a workpiece surface local topography during surface modification of a workpiece, wherein the abrasive construction comprises:
- (a) a three-dimensional, textured, fixed abrasive element;
- (b) at least one resilient element generally coextensive with the fixed abrasive element;
- and
- (c) at least one rigid element generally coextensive with and interposed between the resilient element and the fixed abrasive element, wherein the rigid element has a Young's Modulus greater than that of the resilient element.
An abrasive construction for modifying a workpiece surface, wherein the abrasive construction comprises:
- (a) a three-dimensional, textured, fixed abrasive article comprising a backing on which is disposed an abrasive coating;
- and
- (b) a subpad generally coextensive with the backing of the fixed abrasive article, wherein the subpad comprises:
- (i) at least one resilient element having a Young's Modulus of less than about 100 MPa and a remaining stress in compression of at least about 60%;
- and
- (ii) at least one rigid element generally coextensive with and interposed between the resilient element and the backing of the fixed abrasive article, wherein the rigid element has a Young's Modulus that is greater than that of the resilient element and is at least about 100 MPa.
An abrasive construction for modifying a workpiece surface, wherein the abrasive construction comprises:
- (a) a three-dimensional, textured, fixed abrasive article comprising a backing on which is disposed an abrasive coating;
- and
- (b) a subpad generally coextensive with the backing of the fixed abrasive article, wherein the subpad comprises:
- (i) at least one resilient element having a Young's Modulus of less than about 100 MPa, a remaining stress in compression of at least about 60%, and a thickness of about 0.5-5 mm;
- and
- (ii) at least one rigid element generally coextensive with and interposed between the resilient element and the backing of the fixed abrasive article, wherein the rigid element has a Young's Modulus that is greater than that of the resilient element and at least about 100 MPa, and has a thickness of about 0.075-1.5 min.
Dependencies are inferred from the claim text.