Two Component Chemical Mechanical Polishing
AssigneeWolfspeed, Inc.
InventorsSimon Bubel, Dinusha Priyadarshani Karunaratne
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Abstract
Systems and methods for polishing semiconductor workpieces are provided. In one example, the polishing system includes a platen operable to rotate about an axis. The polishing system further includes a polishing pad on the platen. The polishing system further includes a workpiece carrier operable to bring a semiconductor workpiece into contact with the polishing pad. The polishing pad includes a first zone and a second zone.
Claims20
A polishing system for a semiconductor workpiece, comprising:
- a platen;
- a polishing pad on the platen;
- a workpiece carrier operable to bring the semiconductor workpiece into contact with the polishing pad;
- a separator fixed to the polishing pad, wherein the separator is operable to separate the polishing pad into a first zone and a second zone;
- and
- a delivery system operable to deliver an oxidizing material to the first zone and an oxide removal material to the second zone such that an oxidation process may be implemented on the semiconductor workpiece in a spatially separated manner relative to an oxide removal process.
A polishing system for a semiconductor workpiece, comprising:
- a platen;
- a workpiece carrier operable to bring a semiconductor workpiece into contact with the platen;
- a control system, the control system configured to control an actuator to perform operations, the operations comprising:
- activating an oxidation process on the semiconductor workpiece for a first process period;
- and
- activating an oxide removal process on the semiconductor workpiece for a second process period.
A method for polishing a surface of a workpiece, the method comprising:
- providing a surface of a workpiece on a platen;
- imparting relative motion between the platen and the workpiece;
- providing an oxidizing material to the platen;
- providing an oxide removal material to the platen in a time separated manner or a spatial separated manner relative to providing the oxidizing material to the platen.
Dependencies are inferred from the claim text.