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US 12,521,840 B2Granted
Two component chemical mechanical polishing
AssigneeWolfspeed, Inc.
InventorsSimon Bubel, Dinusha Priyadarshani Karunaratne
Life of this patent
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Abstract
Systems and methods for polishing semiconductor workpieces are provided. In one example, the polishing system includes a platen operable to rotate about an axis. The polishing system further includes a polishing pad on the platen. The polishing system further includes a workpiece carrier operable to bring a semiconductor workpiece into contact with the polishing pad. The polishing pad includes a first zone and a second zone.
Claims18
A polishing system for a semiconductor workpiece, comprising:
- a platen operable to rotate about an axis;
- a polishing pad on the platen;
- a workpiece carrier operable to bring a semiconductor workpiece into contact with the polishing pad;
- a separator fixed to the polishing pad, wherein the separator is operable to separate the polishing pad into a first zone and a second zone;
- and
- a delivery system operable to deliver an oxidizing material to the first zone and an oxide removal material to the second zone such that an oxidation process may be implemented on the workpiece in a spatially separated manner relative to an oxide removal process.
3 more elements
A method of polishing a workpiece, the method comprising:
- providing a surface of a workpiece on a polishing pad;
- imparting relative motion between the polishing pad and the workpiece;
- providing an actuatable material to the polishing pad;
- activating the actuatable material in a pulsed manner to provide a time separation between a first process comprising oxide removal on the workpiece and a second process without oxide removal on the workpiece by pulsing an actuator to selectively activate the actuatable material while imparting relative motion between the polishing pad and the workpiece;
- and
- wherein the actuator is one or more of an electrostatic actuator, electrochemical actuator, acoustic actuator, ultrasonic actuator, optical actuator, thermal actuator, or plasma-based actuator.
3 more elements
Dependencies are inferred from the claim text.