B24B 37/20
Lapping pads for working plane surfaces
B24B37/20 (Lapping pads for working plane surfaces) appears on 2,293 US grants and 2,688 published applications in this corpus.
Search patents in B24B- Granted patents
- 2,293
- Published applications
- 2,688
- Assignees
- 489
- Inventors
- 3,502
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1977 | 1 | 0 |
| 1978 | 1 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 1 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 1 | 0 |
| 1989 | 2 | 0 |
| 1990 | 2 | 0 |
| 1991 | 3 | 0 |
| 1992 | 1 | 0 |
| 1993 | 6 | 0 |
| 1994 | 4 | 0 |
| 1995 | 6 | 0 |
| 1996 | 16 | 0 |
| 1997 | 22 | 0 |
| 1998 | 28 | 0 |
| 1999 | 53 | 0 |
| 2000 | 69 | 0 |
| 2001 | 86 | 62 |
| 2002 | 130 | 128 |
| 2003 | 123 | 133 |
| 2004 | 109 | 163 |
| 2005 | 125 | 122 |
| 2006 | 105 | 127 |
| 2007 | 105 | 119 |
| 2008 | 59 | 83 |
| 2009 | 63 | 85 |
| 2010 | 46 | 72 |
| 2011 | 41 | 66 |
| 2012 | 61 | 76 |
| 2013 | 65 | 81 |
| 2014 | 52 | 75 |
| 2015 | 63 | 89 |
| 2016 | 71 | 108 |
| 2017 | 66 | 141 |
| 2018 | 92 | 122 |
| 2019 | 104 | 100 |
| 2020 | 79 | 120 |
| 2021 | 54 | 110 |
| 2022 | 65 | 106 |
| 2023 | 113 | 117 |
| 2024 | 83 | 106 |
| 2025 | 68 | 103 |
| 2026 | 49 | 74 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Curable composition and abrasive articles made using the same6 Oct 2026US 12,753,266 B23M Innovative Properties Company
- Polishing pad, polishing apparatus, and polishing method22 Sep 2026US 12,741,354 B2Ebara Corporation
- Membrane coating compound for chemical mechanical polishing process, membrane including the same, and polishing apparatus including the same15 Sep 2026US 12,734,637 B2Samsung Electronics Co., Ltd.
- Grooves for edge and hot spot compensation in chemical mechanical polishing15 Sep 2026US 12,734,638 B2APPLIED Materials.Inc.
- Polishing pad, method for producing the same and method of fabricating semiconductor device using the same1 Sep 2026US 12,722,245 B2Enpulse Co., Ltd.
- Polishing method, polishing apparatus, and computer-readable storage medium8 Oct 2026US 2026/0307201 A1Ebara Corporation
- Chemical mechanical polishing temperature scanning apparatus for temperature control8 Oct 2026US 2026/0307202 A1APPLIED Materials.Inc.
- Slurry recycling for chemical mechanical planarazation system8 Oct 2026US 2026/0307209 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Device and method for pressing an upper polishing cloth against an upper polishing plate of a machine for simultaneously polishing a front side and a rear side of a semiconductor wafer1 Oct 2026US 2026/0295768 A1Siltronic AG
- Polishing device1 Oct 2026US 2026/0295769 A1Ebara Corporation
Most cited
By later US patents
- Forming a transparent window in a polishing pad for a chemical mechanical polishing apparatus396US 5,893,796 AAPPLIED Materials.Inc. · 1999
- Method and apparatus for electro-chemical mechanical deposition328US 6,176,992 B1Nutool, Inc. · 2001
- System and method for real-time control of semiconductor a wafer polishing, and a polishing head316US 5,486,129 AMicron Technology, Inc. · 1996
- Polishing pad conditioning apparatus for wafer planarization process292US 5,216,843 AIntel Corporation · 1993
- Polishing pads and methods for their use283US 5,489,233 ARodel, Inc. · 1996