Membrane coating compound for chemical mechanical polishing process, membrane including the same, and polishing apparatus including the same

A membrane structure for a chemical mechanical polishing (CMP) process, the membrane structure comprising:

• a membrane;
• and
• a coating layer on a surface of the membrane, a wafer being fixable on the coating layer,
• wherein the coating layer includes a compound including a functional group capable of hydrogen bonding,
• wherein the functional group capable of hydrogen bonding includes a functional group having a catechol structure, and
• wherein the wafer is fixable by hydrogen bonding between the compound of the coating layer and the wafer.

A polishing apparatus for a chemical mechanical polishing process in which a wafer is holdable under pressure on the polishing apparatus, the polishing apparatus comprising:

• a carrier;
• a membrane below the carrier;
• a coating layer between the membrane and the wafer;
• and
• a spindle mechanism that is coupled to the carrier and is rotatable,
• wherein the coating layer includes a compound including a functional group capable of hydrogen bonding, and
• wherein the functional group capable of hydrogen bonding includes a functional group having a catechol structure.