Polishing device
AssigneeEbara Corporation
InventorsSATOSHI YAMANAKA, MANATO FURUSAWA
Life of this patent
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Abstract
A polishing device for polishing a substrate using a polishing pad is provided, and the polishing device includes a polishing table configured to be capable of spinning and defining a polishing pad holding surface for holding the polishing pad. The polishing pad holding surface is formed with a suction hole connected to a vacuum source, and the polishing table includes a movable member configured to be movable between a protruding state in which the movable member protrudes from the polishing pad holding surface and pushes the polishing pad held on the polishing table in a direction to separate the polishing pad from the polishing pad holding surface, and a retracted state in which the movable member does not protrude from the polishing pad holding surface.
Claims8
A polishing device for polishing a substrate using a polishing pad, the polishing device comprising:
- a polishing table, configured to be capable of spinning and defining a polishing pad holding surface for holding the polishing pad,
- wherein the polishing pad holding surface is formed with a suction hole connected to a vacuum source, and
- the polishing table comprises a movable member configured to be movable between a protruding state in which the movable member protrudes from the polishing pad holding surface and pushes the polishing pad held on the polishing table in a direction to separate the polishing pad from the polishing pad holding surface, and a retracted state in which the movable member does not protrude from the polishing pad holding surface.
Dependencies are inferred from the claim text.