B24B 37/205
Provided with a window for inspecting the surface of the work being
Official title: {provided with a window for inspecting the surface of the work being lapped}
B24B37/205 (Provided with a window for inspecting the surface of the work being) appears on 412 US grants and 476 published applications in this corpus.
Search patents in B24B- Granted patents
- 412
- Published applications
- 476
- Assignees
- 97
- Inventors
- 601
- Latest grant
- 22 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1996 | 1 | 0 |
| 1997 | 4 | 0 |
| 1998 | 5 | 0 |
| 1999 | 4 | 0 |
| 2000 | 7 | 0 |
| 2001 | 9 | 11 |
| 2002 | 21 | 22 |
| 2003 | 18 | 39 |
| 2004 | 25 | 36 |
| 2005 | 32 | 27 |
| 2006 | 25 | 24 |
| 2007 | 27 | 39 |
| 2008 | 13 | 12 |
| 2009 | 21 | 17 |
| 2010 | 11 | 20 |
| 2011 | 13 | 16 |
| 2012 | 12 | 19 |
| 2013 | 19 | 15 |
| 2014 | 13 | 18 |
| 2015 | 21 | 30 |
| 2016 | 19 | 8 |
| 2017 | 11 | 10 |
| 2018 | 13 | 19 |
| 2019 | 12 | 18 |
| 2020 | 10 | 12 |
| 2021 | 8 | 6 |
| 2022 | 6 | 14 |
| 2023 | 12 | 14 |
| 2024 | 6 | 16 |
| 2025 | 8 | 10 |
| 2026 | 6 | 4 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Polishing pad, polishing apparatus, and polishing method22 Sep 2026US 12,741,354 B2Ebara Corporation
- Polishing pad and method for manufacturing semiconductor device using the same1 Sep 2026US 12,722,246 B2Enpulse Co., Ltd.
- Acoustic window in pad polishing and backing layer for chemical mechanical polishing14 Jul 2026US 12,678,914 B2APPLIED Materials.Inc.
- Substrate processing apparatus and substrate processing method14 Jul 2026US 12,678,915 B2Samsung Electronics Co., Ltd.
- Polishing pad with window and method of manufacturing the same14 Apr 2026US 12,600,006 B2Enpulse Co., Ltd.
- Method of producing reference spectral library for use in film-thickness estimation for workpiece9 Jul 2026US 2026/0192417 A1Ebara Corporation
- Chemical mechanical planarization tool7 May 2026US 2026/0124711 A1
- Online monitoring device for cmp5 Feb 2026US 2026/0034639 A1Hangzhou Sizone Electronic Technology Inc.
- Cmp pad and cmp equipment22 Jan 2026US 2026/0021552 A1Shanghai Huali Integrated Circuit Corporation
- Polishing pad and method for manufacturing polished workpiece23 Oct 2025US 2025/0326083 A1
Most cited
By later US patents
- Forming a transparent window in a polishing pad for a chemical mechanical polishing apparatus396US 5,893,796 AAPPLIED Materials.Inc. · 1999
- System and method for real-time control of semiconductor a wafer polishing, and a polishing head316US 5,486,129 AMicron Technology, Inc. · 1996
- System for real-time control of semiconductor wafer polishing including optical monitoring282US 5,658,183 AMicron Technology, Inc. · 1997
- Polishing pads268US 5,605,760 ARodel, Inc. · 1997
- Apparatus and method for in-situ monitoring of chemical mechanical polishing operations261US 5,964,643 AAPPLIED Materials.Inc. · 1999