Cmp pad and cmp equipment

Chemical mechanical polishing (CMP) equipment, comprising a pad, the pad comprising:

• a first surface and a second surface opposite to each other, the first surface being a polishing surface and being circular;
• and
• a plurality of monitor windows, each of the monitor windows penetrating through the first surface and the second surface, each of the monitor windows being uniformly distributed on a first circle, a first annular region centered on the first circle being a monitor window influence zone, the monitor windows causing an increase in a brush rate of a slurry in the monitor window influence zone,
• wherein the first surface is provided thereon with a groove pattern structure which is used to adjust a brush rate of a slurry on the first surface and causes a decrease in the brush rate of the slurry in the monitor window influence zone to compensate for an influence of the monitor windows on the increase in the brush rate of the slurry in the monitor window influence zone,
• the second surface of the pad is arranged on a polishing table, and
• a polishing head is disposed above the first surface of the pad, which is used to fix a polished member and press a polished surface of the polished member against the first surface.