B24B 37/11
Lapping tools
B24B37/11 (Lapping tools) appears on 2,599 US grants and 2,936 published applications in this corpus.
Search patents in B24B- Granted patents
- 2,599
- Published applications
- 2,936
- Assignees
- 547
- Inventors
- 3,923
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1977 | 1 | 0 |
| 1978 | 1 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 1 | 0 |
| 1982 | 1 | 0 |
| 1983 | 0 | 0 |
| 1984 | 1 | 0 |
| 1985 | 1 | 0 |
| 1986 | 0 | 0 |
| 1987 | 1 | 0 |
| 1988 | 1 | 0 |
| 1989 | 5 | 0 |
| 1990 | 3 | 0 |
| 1991 | 6 | 0 |
| 1992 | 1 | 0 |
| 1993 | 7 | 0 |
| 1994 | 5 | 0 |
| 1995 | 8 | 0 |
| 1996 | 17 | 0 |
| 1997 | 29 | 0 |
| 1998 | 34 | 0 |
| 1999 | 61 | 0 |
| 2000 | 83 | 0 |
| 2001 | 115 | 65 |
| 2002 | 151 | 150 |
| 2003 | 145 | 146 |
| 2004 | 127 | 176 |
| 2005 | 149 | 139 |
| 2006 | 120 | 133 |
| 2007 | 114 | 132 |
| 2008 | 63 | 89 |
| 2009 | 67 | 92 |
| 2010 | 48 | 78 |
| 2011 | 48 | 74 |
| 2012 | 69 | 83 |
| 2013 | 69 | 82 |
| 2014 | 57 | 83 |
| 2015 | 65 | 94 |
| 2016 | 76 | 120 |
| 2017 | 70 | 150 |
| 2018 | 100 | 129 |
| 2019 | 110 | 111 |
| 2020 | 93 | 133 |
| 2021 | 57 | 118 |
| 2022 | 71 | 122 |
| 2023 | 125 | 127 |
| 2024 | 94 | 118 |
| 2025 | 73 | 113 |
| 2026 | 56 | 79 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Curable composition and abrasive articles made using the same6 Oct 2026US 12,753,266 B23M Innovative Properties Company
- Apparatus and methods for chemical mechanical polishing29 Sep 2026US 12,746,636 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Polishing pad, polishing apparatus, and polishing method22 Sep 2026US 12,741,354 B2Ebara Corporation
- Membrane coating compound for chemical mechanical polishing process, membrane including the same, and polishing apparatus including the same15 Sep 2026US 12,734,637 B2Samsung Electronics Co., Ltd.
- Grooves for edge and hot spot compensation in chemical mechanical polishing15 Sep 2026US 12,734,638 B2APPLIED Materials.Inc.
- Polishing method, polishing apparatus, and computer-readable storage medium8 Oct 2026US 2026/0307201 A1Ebara Corporation
- Chemical mechanical polishing temperature scanning apparatus for temperature control8 Oct 2026US 2026/0307202 A1APPLIED Materials.Inc.
- Slurry recycling for chemical mechanical planarazation system8 Oct 2026US 2026/0307209 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Substrate processing apparatus and substrate processing method8 Oct 2026US 2026/0314295 A1Ebara Corporation
- Device and method for pressing an upper polishing cloth against an upper polishing plate of a machine for simultaneously polishing a front side and a rear side of a semiconductor wafer1 Oct 2026US 2026/0295768 A1Siltronic AG
Most cited
By later US patents
- Forming a transparent window in a polishing pad for a chemical mechanical polishing apparatus396US 5,893,796 AAPPLIED Materials.Inc. · 1999
- Method and apparatus for electro-chemical mechanical deposition328US 6,176,992 B1Nutool, Inc. · 2001
- System and method for real-time control of semiconductor a wafer polishing, and a polishing head316US 5,486,129 AMicron Technology, Inc. · 1996
- Polishing pad conditioning apparatus for wafer planarization process292US 5,216,843 AIntel Corporation · 1993
- Polishing pads and methods for their use283US 5,489,233 ARodel, Inc. · 1996