Polishing method, polishing apparatus, and computer-readable storage medium
AssigneeEbara Corporation
InventorHirotaka SATORI
Life of this patent
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AssigneeEbara Corporation
InventorHirotaka SATORI
Estimating the term…
The present invention relates to a polishing method of polishing a substrate, such as a wafer or a panel. The polishing method includes: rotating a polishing pad (polishing tool) (1) having a polishing surface (1a); pressing a substrate (W) against the polishing surface (1a) to polish the substrate (W); during polishing of the substrate, determining whether each of multiple measurement data points measured by a sensor (30) is an effective data point; and determining a representative measurement value of physical quantity based on a measurement value of a measurement data point that has been determined to be the effective data point each time the polishing table (3) makes one revolution. Determining whether each of the multiple measurement data points is the effective data point comprises counting the number of measurement data points within a search area and determining that a determination-target measurement data point is the effective data point when the number of measurement data points within the search area is equal to or more than a threshold value.
A polishing method comprising:
A polishing apparatus comprising:
A computer-readable storage medium storing a program for causing a computer to perform:
Dependencies are inferred from the claim text.