Device and method for pressing an upper polishing cloth against an upper polishing plate of a machine for simultaneously polishing a front side and a rear side of a semiconductor wafer

Abstract

A device presses an upper polishing cloth against an upper polishing plate of a machine for simultaneously polishing a front side and a rear side of a semiconductor wafer between the upper polishing plate and a lower polishing plate. The device includes: two parallel linear rails, which are arranged at a distance above the lower polishing plate, parallel to a radius, lying in between, of the lower polishing plate; a base body to which the linear rails are fastened; two driven carriages, which are movable along the linear rails; actuators, carried by the carriages, the actuators being configured to raise and lower a roller, which is fastened to the actuators and arranged between the linear rails; and a controller configured to synchronously move the carriages to and fro between an inner pin crown and an outer pin crown of the machine and configured to synchronously move the actuators.

Dependencies are inferred from the claim text.