B24B 37/12
Lapping plates for working plane surfaces
B24B37/12 (Lapping plates for working plane surfaces) appears on 343 US grants and 326 published applications in this corpus.
Search patents in B24B- Granted patents
- 343
- Published applications
- 326
- Assignees
- 146
- Inventors
- 772
- Latest grant
- 21 Jul 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1982 | 1 | 0 |
| 1983 | 0 | 0 |
| 1984 | 1 | 0 |
| 1985 | 1 | 0 |
| 1986 | 0 | 0 |
| 1987 | 1 | 0 |
| 1988 | 0 | 0 |
| 1989 | 3 | 0 |
| 1990 | 1 | 0 |
| 1991 | 3 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 1 | 0 |
| 1995 | 2 | 0 |
| 1996 | 4 | 0 |
| 1997 | 8 | 0 |
| 1998 | 7 | 0 |
| 1999 | 12 | 0 |
| 2000 | 19 | 0 |
| 2001 | 13 | 15 |
| 2002 | 25 | 29 |
| 2003 | 29 | 21 |
| 2004 | 25 | 20 |
| 2005 | 23 | 19 |
| 2006 | 19 | 7 |
| 2007 | 11 | 21 |
| 2008 | 5 | 9 |
| 2009 | 8 | 8 |
| 2010 | 4 | 7 |
| 2011 | 6 | 8 |
| 2012 | 10 | 6 |
| 2013 | 3 | 5 |
| 2014 | 4 | 9 |
| 2015 | 5 | 11 |
| 2016 | 7 | 4 |
| 2017 | 5 | 9 |
| 2018 | 8 | 13 |
| 2019 | 3 | 17 |
| 2020 | 17 | 14 |
| 2021 | 4 | 10 |
| 2022 | 6 | 16 |
| 2023 | 14 | 15 |
| 2024 | 14 | 16 |
| 2025 | 5 | 10 |
| 2026 | 6 | 7 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Tool for modifying a support surface21 Jul 2026US 12,687,790 B2ASML Netherlands B. V.
- Systems and methods for suction pad assemblies26 May 2026US 12,642,056 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Pad conditioner cut rate monitoring17 Mar 2026US 12,576,476 B2APPLIED Materials.Inc.
- Substrate processing apparatus and substrate processing method10 Mar 2026US 12,569,957 B2Ebara Corporation
- Silicone adsorption film10 Mar 2026US 12,570,853 B2Fujicopian Co., Ltd.
- Substrate processing device and substrate processing method27 Aug 2026US 2026/0249419 A1Ebara Corporation
- Substrate polishing device and polishing pad13 Aug 2026US 2026/0233356 A1Ebara Corporation
- Superhard material abrasive tool and grinding process for difficult-to-machine materials18 Jun 2026US 2026/0166679 A1Guilin Champion Union Diamond Co., Ltd.
- Grind Wheel Design for Low Edge-Roll Grinding28 May 2026US 2026/0145290 A1Wolfspeed, Inc.
- Substrate polishing apparatus28 May 2026US 2026/0145296 A1Samsung Electronics Co., Ltd.
Most cited
By later US patents
- System and method for real-time control of semiconductor a wafer polishing, and a polishing head316US 5,486,129 AMicron Technology, Inc. · 1996
- System for real-time control of semiconductor wafer polishing including optical monitoring282US 5,658,183 AMicron Technology, Inc. · 1997
- System for real-time control of semiconductor wafer polishing including optical montoring249US 5,730,642 AMicron Technology, Inc. · 1998
- System for real-time control of semiconductor wafer polishing186US 5,851,135 AMicron Technology, Inc. · 1998
- System for real-time control of semiconductor wafer polishing160US 5,700,180 AMicron Technology, Inc. · 1997