Grind Wheel Design for Low Edge-Roll Grinding
AssigneeWolfspeed, Inc.
InventorsSimon Bubel, Robert Leonard
Life of this patent
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Abstract
Grinding systems and methods for semiconductor workpieces are provided. In one example, a grinding system includes a workpiece support operable to support a semiconductor workpiece and rotate the semiconductor workpiece about a first axis. The grinding system further includes a grind wheel operable to rotate about a second axis. The grind wheel has a plurality of grinding teeth arranged in a grinding ring on the grind wheel. A radius of the grinding ring is less than or equal to a radius of the semiconductor workpiece (e.g., such that an effective gap ratio between grinding teeth on the grind wheel are reduced).
Claims20
A grinding system for a semiconductor workpiece, comprising:
- a workpiece support operable to support a semiconductor workpiece and rotate the semiconductor workpiece about a first axis;
- and
- a grind wheel operable to rotate about a second axis, wherein the grind wheel has a continuous grinding ring on the grind wheel, the continuous grinding ring comprising an abrasive containing material.
A method for grinding a surface of a semiconductor workpiece, comprising:
- providing a semiconductor workpiece on a workpiece support, the workpiece support rotatable about a first axis;
- providing a surface of the semiconductor workpiece against a continuous grinding ring on a grind wheel, the grind wheel rotatable about a second axis, the continuous grinding ring comprising an abrasive containing material;
- and
- rotating one or more of the grind wheel or the workpiece support to implement a grinding operation on the semiconductor workpiece.
A Blanchard ground semiconductor wafer comprising a silicon carbide surface, wherein the semiconductor wafer has an edge roll over 10 millimeters from a peripheral edge of the semiconductor wafer of less than about 0.7 microns.
Dependencies are inferred from the claim text.