Substrate processing apparatus and substrate processing method
AssigneeEbara Corporation
InventorsKohei Ota, Nobuyuki Takada
Life of this patent
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Abstract
To suppress damage to a surface to be polished of a substrate and improve a polishing rate. A substrate processing apparatus includes a table 100 for supporting a substrate WF, a pad holder 226 for holding a polishing pad 222 for polishing the substrate WF supported by the table 100, a nozzle 228 for supplying a polishing liquid around the pad holder 226, and a pad rotation mechanism for rotating the pad holder 226. The pad holder 226 includes a discharge hole 221-2a formed in the center of a holding surface 221-2c configured to hold the polishing pad 222 and a discharge passage 221-2b communicated with an outside of the pad holder 226 from the discharge hole 221-2a.
Claims9
A substrate processing apparatus comprising:
- a table for supporting a substrate;
- a pad holder for holding a polishing pad for polishing the substrate supported by the table;
- a nozzle for supplying a polishing liquid around the pad holder;
- and
- a pad rotation mechanism for rotating the pad holder, wherein
- the pad holder includes:
- a discharge hole formed in a center of a holding surface configured to hold the polishing pad, the holding surface being defined at a bottom of the pad holder;
- and
- a discharge passage communicated with an outside of the pad holder from the discharge hole,
- wherein the discharge passage is formed in the pad holder so as to communicate the discharge hole with a side surface of the pad holder.
Dependencies are inferred from the claim text.